Asymmetric SiGe BiCMOS SPDT Switch With 210 fs RON × COFF for 5G Applications

0 ENGINEERING, ELECTRICAL & ELECTRONIC
Kejie Hu;Kaixue Ma;Jiancheng Huang;Haipeng Fu
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引用次数: 0

Abstract

This article presents a compact high-linearity single-pole double-throw (SPDT) switch built using a 0.13- $\mu$ m SiGe BiCMOS technology for Ka-band 5G. The body-floating technique (BFT) based on the deep-n-well (DNW) transistor is used in the asymmetric structure to decrease substrate leakage and improve the power-handling capability in TX mode. Advanced performances have been achieved from the RF switch point of view with 210 fs ${R}_{\text{ON}} \times {C}_{\text{OFF}}$ . The proposed design achieved a minimum insertion loss (IL) of 0.53/1.33 dB including pad losses, isolation of more than 21/15 dB, and IP1dB of 20/8.5 dBm in TX/RX mode. The measured IIP3 is 34.3/28 dBm at 28 GHz. The active chip area is 0.046 mm2. In contrast to the conventional structure with heterojunction bipolar transistor (HBT) or PIN diodes in SiGe process, the proposed SPDT exhibits good performances with a compact area for modern asymmetric front-end applications.
非对称SiGe BiCMOS SPDT开关,210秒RON × COFF,适用于5G应用
本文介绍了一种紧凑的高线性单极双掷(SPDT)开关,该开关采用0.13- $\mu$ m SiGe BiCMOS技术构建,用于ka频段5G。在非对称结构中采用了基于深阱晶体管的体浮技术(BFT),以减少衬底泄漏,提高TX模式下的功率处理能力。从射频开关的角度来看,210 fs ${R}_{\text{ON}} \乘以{C}_{\text{OFF}}$实现了先进的性能。该设计的最小插入损耗(IL)为0.53/1.33 dB,包括焊盘损耗,隔离度超过21/15 dB,在TX/RX模式下的IP1dB为20/8.5 dBm。测量到的IIP3在28 GHz时为34.3/28 dBm。有效芯片面积为0.046 mm2。与SiGe工艺中采用异质结双极晶体管(HBT)或PIN二极管的传统结构相比,本文提出的SPDT具有良好的性能和紧凑的面积,适合现代非对称前端应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
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