Daihyun Hwang, Woojin Jeon, Seokju Lee, Shinya Onoue, Hyeon-Deuk Hwang, Johannes Gierschner and Min Sang Kwon*,
{"title":"A Multicomponent Visible-Light Initiating System for Rapid and Deep Photocuring through UV-Opaque Polyimide Films","authors":"Daihyun Hwang, Woojin Jeon, Seokju Lee, Shinya Onoue, Hyeon-Deuk Hwang, Johannes Gierschner and Min Sang Kwon*, ","doi":"10.1021/acsapm.4c0354410.1021/acsapm.4c03544","DOIUrl":null,"url":null,"abstract":"<p >Polyimides (PIs) play a crucial role in modern electronics, especially in flexible printed circuit boards (FPCBs). However, these FPCBs are vulnerable to physical damage, which can compromise the copper wiring. To protect this wiring, encapsulation with resin is commonly used. Traditional UV-curable resins, however, are ineffective due to the UV opacity of PI films, which hinders proper curing. In this study, we present an advanced multicomponent photoinitiating system, activated by visible light, that enables rapid and deep curing of acrylic resins even through UV-opaque PI films. This system, which integrates camphorquinone/amine (a well-established type II system) with a highly efficient triplet-generating photoredox catalyst and co-initiators, offers exceptional curing speed and depth. When tested on a real FPCB, the system achieved a curing depth exceeding 1 cm within just 10 s under 480 nm LED light, highlighting its practical value for intricate FPCB designs. We believe that this system will play a key role in a variety of applications that require fast and deep photocuring, such as three-dimensional/four-dimensional printing.</p>","PeriodicalId":7,"journal":{"name":"ACS Applied Polymer Materials","volume":"7 3","pages":"1741–1751 1741–1751"},"PeriodicalIF":4.4000,"publicationDate":"2025-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Polymer Materials","FirstCategoryId":"92","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsapm.4c03544","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Polyimides (PIs) play a crucial role in modern electronics, especially in flexible printed circuit boards (FPCBs). However, these FPCBs are vulnerable to physical damage, which can compromise the copper wiring. To protect this wiring, encapsulation with resin is commonly used. Traditional UV-curable resins, however, are ineffective due to the UV opacity of PI films, which hinders proper curing. In this study, we present an advanced multicomponent photoinitiating system, activated by visible light, that enables rapid and deep curing of acrylic resins even through UV-opaque PI films. This system, which integrates camphorquinone/amine (a well-established type II system) with a highly efficient triplet-generating photoredox catalyst and co-initiators, offers exceptional curing speed and depth. When tested on a real FPCB, the system achieved a curing depth exceeding 1 cm within just 10 s under 480 nm LED light, highlighting its practical value for intricate FPCB designs. We believe that this system will play a key role in a variety of applications that require fast and deep photocuring, such as three-dimensional/four-dimensional printing.
期刊介绍:
ACS Applied Polymer Materials is an interdisciplinary journal publishing original research covering all aspects of engineering, chemistry, physics, and biology relevant to applications of polymers.
The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates fundamental knowledge in the areas of materials, engineering, physics, bioscience, polymer science and chemistry into important polymer applications. The journal is specifically interested in work that addresses relationships among structure, processing, morphology, chemistry, properties, and function as well as work that provide insights into mechanisms critical to the performance of the polymer for applications.