Amorphous indium gallium zinc oxide thin film transistors (a-IGZO-TFTs): Exciting prospects and fabrication challenges

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
J. Ajayan , S. Sreejith , N. Aruna Kumari , M. Manikandan , Sachidananda Sen , Maneesh Kumar
{"title":"Amorphous indium gallium zinc oxide thin film transistors (a-IGZO-TFTs): Exciting prospects and fabrication challenges","authors":"J. Ajayan ,&nbsp;S. Sreejith ,&nbsp;N. Aruna Kumari ,&nbsp;M. Manikandan ,&nbsp;Sachidananda Sen ,&nbsp;Maneesh Kumar","doi":"10.1016/j.mee.2025.112327","DOIUrl":null,"url":null,"abstract":"<div><div>In today's consumer electronics market, major manufacturing companies may be profitable and scalable thanks to technologies like thin-film transistors (TFTs). TFTs are found in TVs, smartphones, laptops, brain-like synaptic transistors, back-planes in CMOS image sensors, integrated circuits (ICs), flexible &amp; wearable electronics, power switching circuits, back-end-of-line (BEOL) transistor elements in 3D-logic and cell transistors in dynamic random-access memory (DRAM). They have also been proposed as a potential solution for flexible CPUs. A high mobility of 74.4 cm<sup>2</sup>/Vs and I<sub>ON</sub>/I<sub>OFF</sub> of 3.39 × 10<sup>9</sup> and a V<sub>ON</sub> of less than ±0.1 V and a SS of less than 0.1 V/dec were achieved in a-IGZO based TFTs. Numerous efforts have been made to enhance the a-IGZO TFTs' electrical characteristics by optimizing the fabrication process. Numerous studies have also addressed the instability problems, such as the a-IGZO devices' hot-carrier effects, self-heating, and charge-trapping. TFTs with a-IGZO are being extensively studied adopting the a vertical-channel approach in order to be used in 3-D electronic devices. This article reviews the recent developments in materials and architectures, performance overview of IGZO-TFTs, advances and challenges in fabrication technologies and reliability issues &amp; degradation mechanisms of IGZO-TFTs.</div></div>","PeriodicalId":18557,"journal":{"name":"Microelectronic Engineering","volume":"298 ","pages":"Article 112327"},"PeriodicalIF":2.6000,"publicationDate":"2025-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167931725000164","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In today's consumer electronics market, major manufacturing companies may be profitable and scalable thanks to technologies like thin-film transistors (TFTs). TFTs are found in TVs, smartphones, laptops, brain-like synaptic transistors, back-planes in CMOS image sensors, integrated circuits (ICs), flexible & wearable electronics, power switching circuits, back-end-of-line (BEOL) transistor elements in 3D-logic and cell transistors in dynamic random-access memory (DRAM). They have also been proposed as a potential solution for flexible CPUs. A high mobility of 74.4 cm2/Vs and ION/IOFF of 3.39 × 109 and a VON of less than ±0.1 V and a SS of less than 0.1 V/dec were achieved in a-IGZO based TFTs. Numerous efforts have been made to enhance the a-IGZO TFTs' electrical characteristics by optimizing the fabrication process. Numerous studies have also addressed the instability problems, such as the a-IGZO devices' hot-carrier effects, self-heating, and charge-trapping. TFTs with a-IGZO are being extensively studied adopting the a vertical-channel approach in order to be used in 3-D electronic devices. This article reviews the recent developments in materials and architectures, performance overview of IGZO-TFTs, advances and challenges in fabrication technologies and reliability issues & degradation mechanisms of IGZO-TFTs.
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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