Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging

IF 8.1 2区材料科学 Q1 ENGINEERING, MANUFACTURING

Composites Part A: Applied Science and Manufacturing Pub Date : 2025-01-31 DOI:10.1016/j.compositesa.2025.108757

Wei-Cheng Chao, Chia-Pei Chu, Ying-Chih Liao

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Abstract

Packaging materials are crucial for chip performance, directly impacting heat dissipation, warpage, and signal quality. However, balancing flowability and solid content often limits their effectiveness. Herein, a novel methodology is developed for creating ultrahigh-solid-content liquid molding compounds (LMCs) with low viscosity and exceptional properties. By establishing a mathematical model that accurately predicts composites’ viscosity and optimal maximum packing density based on binary size-distributed samples, achieving 78.0 vol% LMC. Its excellent flowability enables superior processability, with precise thickness control and low surface roughness on wafer coatings. The low thermal expansion coefficient (α₁ = 11.4 ppm °C⁻¹) ensures minimal warpage and strong adhesion. Dielectric properties (Dk/Df = 2.62/0.0062) significantly lower than commercial FR-4 materials are reached. Besides a high flexural strength of 142.2 MPa, the 78 vol% LMC demonstrates thermal conductivity (1.33 W m⁻¹ K⁻¹) closely approaching pure silica. These outstanding properties highlight the practicality of the ultrahigh-solid-content LMCs for advanced wafer-level packaging applications.

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来源期刊

Composites Part A: Applied Science and Manufacturing 工程技术-材料科学：复合

CiteScore

15.20

自引率

5.70%

发文量

492

审稿时长

30 days

期刊介绍： Composites Part A: Applied Science and Manufacturing is a comprehensive journal that publishes original research papers, review articles, case studies, short communications, and letters covering various aspects of composite materials science and technology. This includes fibrous and particulate reinforcements in polymeric, metallic, and ceramic matrices, as well as 'natural' composites like wood and biological materials. The journal addresses topics such as properties, design, and manufacture of reinforcing fibers and particles, novel architectures and concepts, multifunctional composites, advancements in fabrication and processing, manufacturing science, process modeling, experimental mechanics, microstructural characterization, interfaces, prediction and measurement of mechanical, physical, and chemical behavior, and performance in service. Additionally, articles on economic and commercial aspects, design, and case studies are welcomed. All submissions undergo rigorous peer review to ensure they contribute significantly and innovatively, maintaining high standards for content and presentation. The editorial team aims to expedite the review process for prompt publication.