A high accuracy bandgap reference with adaptive mechanical stress compensation

IF 3 3区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Aeu-International Journal of Electronics and Communications Pub Date : 2025-02-01 DOI:10.1016/j.aeue.2025.155674

Pengda Qu , Zhiming Xiao , Yue Zhao , Khalil Yousef

{"title":"A high accuracy bandgap reference with adaptive mechanical stress compensation","authors":"Pengda Qu , Zhiming Xiao , Yue Zhao , Khalil Yousef","doi":"10.1016/j.aeue.2025.155674","DOIUrl":null,"url":null,"abstract":"<div><div>Mechanical stress due to packaging and soldering process is a random non-ideal factor which has been annoying the design of high accuracy analog ICs for a long time. Soldering and mechanical stress would make trimming meaningless after packaging in bandgap reference (BGR) circuits. This paper proposes adaptive stress compensation technique for high accuracy BGR design. This is implemented by feeding the bandgap circuit with a compensation current extracted from the difference of the base-emitter junctions’ voltage (<span><math><msub><mrow><mi>V</mi></mrow><mrow><mi>B</mi><mi>E</mi></mrow></msub></math></span>) variations between NPN and PNP bipolar transistors experiencing the same stress. It was found that the temperature coefficient variations caused by soldering can be enhanced by a factor of 45.3%. The measured temperature coefficient of the reference voltage before soldering is 7.02 ppm/°C, while it is 24.73 ppm/°C after soldering. The proposed compensation technique reduced the measured reference voltage temperature coefficient to 15.03 ppm/°C.</div></div>","PeriodicalId":50844,"journal":{"name":"Aeu-International Journal of Electronics and Communications","volume":"191 ","pages":"Article 155674"},"PeriodicalIF":3.0000,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Aeu-International Journal of Electronics and Communications","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1434841125000159","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Mechanical stress due to packaging and soldering process is a random non-ideal factor which has been annoying the design of high accuracy analog ICs for a long time. Soldering and mechanical stress would make trimming meaningless after packaging in bandgap reference (BGR) circuits. This paper proposes adaptive stress compensation technique for high accuracy BGR design. This is implemented by feeding the bandgap circuit with a compensation current extracted from the difference of the base-emitter junctions’ voltage (

V_{B E}

) variations between NPN and PNP bipolar transistors experiencing the same stress. It was found that the temperature coefficient variations caused by soldering can be enhanced by a factor of 45.3%. The measured temperature coefficient of the reference voltage before soldering is 7.02 ppm/°C, while it is 24.73 ppm/°C after soldering. The proposed compensation technique reduced the measured reference voltage temperature coefficient to 15.03 ppm/°C.

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具有自适应机械应力补偿的高精度带隙基准

封装和焊接过程中产生的机械应力是一个随机的非理想因素，长期困扰着高精度模拟集成电路的设计。在带隙参考（BGR）电路封装后，焊接和机械应力会使修整变得毫无意义。针对高精度BGR设计，提出了自适应应力补偿技术。这是通过向带隙电路提供补偿电流来实现的，补偿电流是从经历相同应力的NPN和PNP双极晶体管之间基极-发射极结电压（VBE）变化的差异中提取的。结果表明，焊接引起的温度系数变化可提高45.3%。测得的参考电压在焊接前的温度系数为7.02 ppm/°C，而焊接后的温度系数为24.73 ppm/°C。所提出的补偿技术将测量的参考电压温度系数降低到15.03 ppm/°C。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Aeu-International Journal of Electronics and Communications 工程技术-电信学

CiteScore

6.90

自引率

18.80%

发文量

292

审稿时长

4.9 months

期刊介绍： AEÜ is an international scientific journal which publishes both original works and invited tutorials. The journal''s scope covers all aspects of theory and design of circuits, systems and devices for electronics, signal processing, and communication, including: signal and system theory, digital signal processing network theory and circuit design information theory, communication theory and techniques, modulation, source and channel coding switching theory and techniques, communication protocols optical communications microwave theory and techniques, radar, sonar antennas, wave propagation AEÜ publishes full papers and letters with very short turn around time but a high standard review process. Review cycles are typically finished within twelve weeks by application of modern electronic communication facilities.