Highly Thermally Conductive and Flame-Retardant Waterborne Polyurethane Composites with 3D BNNS Bridging Structures via Magnetic Field Assistance

IF 26.6 1区 材料科学 Q1 Engineering
Hao Jiang, Yuhui Xie, Mukun He, Jindao Li, Feng Wu, Hua Guo, Yongqiang Guo, Delong Xie, Yi Mei, Junwei Gu
{"title":"Highly Thermally Conductive\nand Flame-Retardant Waterborne Polyurethane Composites with 3D BNNS Bridging Structures via Magnetic\nField Assistance","authors":"Hao Jiang,&nbsp;Yuhui Xie,&nbsp;Mukun He,&nbsp;Jindao Li,&nbsp;Feng Wu,&nbsp;Hua Guo,&nbsp;Yongqiang Guo,&nbsp;Delong Xie,&nbsp;Yi Mei,&nbsp;Junwei Gu","doi":"10.1007/s40820-025-01651-1","DOIUrl":null,"url":null,"abstract":"<div><h2>Highlights</h2><div>\n \n <ul>\n <li>\n <p>By simultaneously incorporating the magnetic filler-modified boron nitride nanosheets (M@BNNS) and the non-magnetic filler U-BNNS into the polymer matrix, a three-dimensional heat conduction pathway composites are obtained under a horizontal magnetic field.</p>\n </li>\n <li>\n <p>Owing to the microstructural design of the 3D-bridging architecture, with the addition of only 5 wt% U-BNNS, the <i>λ</i><sub><b>⊥</b></sub> of composites achieved 2.88 W m<sup>−1</sup> K<sup>−1</sup>, representing a remarkable increase of 194.2% compared to single-oriented composites.</p>\n </li>\n <li>\n <p>The 3D-bridging architecture composite also demonstrates excellent flame retardancy, attributed to the synergistic mechanisms of condensed and gas phases, effectively mitigating the risks of thermal runaway in electronic devices.</p>\n </li>\n </ul>\n </div></div>","PeriodicalId":714,"journal":{"name":"Nano-Micro Letters","volume":"17 1","pages":""},"PeriodicalIF":26.6000,"publicationDate":"2025-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s40820-025-01651-1.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nano-Micro Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s40820-025-01651-1","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

Abstract

Highlights

  • By simultaneously incorporating the magnetic filler-modified boron nitride nanosheets (M@BNNS) and the non-magnetic filler U-BNNS into the polymer matrix, a three-dimensional heat conduction pathway composites are obtained under a horizontal magnetic field.

  • Owing to the microstructural design of the 3D-bridging architecture, with the addition of only 5 wt% U-BNNS, the λ of composites achieved 2.88 W m−1 K−1, representing a remarkable increase of 194.2% compared to single-oriented composites.

  • The 3D-bridging architecture composite also demonstrates excellent flame retardancy, attributed to the synergistic mechanisms of condensed and gas phases, effectively mitigating the risks of thermal runaway in electronic devices.

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来源期刊
Nano-Micro Letters
Nano-Micro Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
32.60
自引率
4.90%
发文量
981
审稿时长
1.1 months
期刊介绍: Nano-Micro Letters is a peer-reviewed, international, interdisciplinary, and open-access journal published under the SpringerOpen brand. Nano-Micro Letters focuses on the science, experiments, engineering, technologies, and applications of nano- or microscale structures and systems in various fields such as physics, chemistry, biology, material science, and pharmacy.It also explores the expanding interfaces between these fields. Nano-Micro Letters particularly emphasizes the bottom-up approach in the length scale from nano to micro. This approach is crucial for achieving industrial applications in nanotechnology, as it involves the assembly, modification, and control of nanostructures on a microscale.
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