High-strength nanostructured copper alloys via mechanical consolidation of pure copper and Fe-Si-B glassy powers

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2025-02-01 DOI:10.1016/j.vacuum.2025.114101

Hongbo Zhou , Haihong Jiang , Li Yu , Gan Ding , Songlin Cai , Depeng Shen , Minqiang Jiang , Gerhard Wilde

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Abstract

High-strength nanostructured copper alloys were fabricated through the mechanical consolidation of pure copper and Fe-Si-B glassy powders using a two-step high-pressure torsion (HPT) process. Structural characterization by transmission electron microscopy and electron backscatter diffraction revealed that, after overall 20 HPT revolutions, 1 wt% Fe₇₈Si₉B₁₃ glassy powders can be fully decomposed and homogeneously supersaturated into the copper matrix. The resulting Cu-1 wt.% FeSiB alloy exhibited a compositionally uniform nanostructure with an average grain size of 63.3 nm and a high proportion of low-angle grain boundaries (54.2 %), achieving an ultimate tensile strength of 1246 MPa. In contrast, the addition of 5 wt% Fe₇₈Si₉B₁₃ glassy powder under the identical HPT conditions resulted in a crystal-glass composite structure with an ultimate tensile strength of 895.8 MPa. This work advances a hybrid method that integrates bottom-up particle bonding with top-down grain refinement to fabricate high-performance alloys.

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.