Modulation of microstructure and properties of Cu−Ni−Sn alloy by addition of trace Ti

IF 4.7 1区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING
Ying-lin HU , Zi-luo CHENG , Xiao-na LI , Zhu-min LI , Yuan-di HOU , Min LI , Mian YANG , Yue-hong ZHENG , Chuang DONG
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引用次数: 0

Abstract

The segregation of Sn and discontinuous precipitation at grain boundaries are detrimental to the strength, ductility, and machinability of the Cu−Ni−Sn alloy. A strategy to solve the above problems is multi-component composition design by introducing strong enthalpic interaction element. In this work, a series of Cu80Ni15Sn5−xTix (at.%) alloys were designed by cluster-plus-glue-atom model, and the effects of Ti content on the microstructure and properties of the alloys were systematically investigated using TEM and other analysis methods. The results demonstrate that Ti can effectively inhibit the segregation and discontinuous precipitation while promoting continuous precipitation to improve the high-temperature stability of the alloys. As the Ti content increases, the distribution of Ti changes from uniform distribution to predominant precipitation. The hardness and conductivity of the alloy exceed those of the C72900 (Cu−15Ni−8Sn (wt.%)) commercial alloy and the Cu80Ni15Sn5 (at.%) reference alloy when Ti is in the solution state.
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来源期刊
CiteScore
7.40
自引率
17.80%
发文量
8456
审稿时长
3.6 months
期刊介绍: The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.
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