Amnani Abu Bakar , N.H. Hashim , H.A. Tajuddin , A.S. Sadun , Z.H.Z. Abidin
{"title":"Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion","authors":"Amnani Abu Bakar , N.H. Hashim , H.A. Tajuddin , A.S. Sadun , Z.H.Z. Abidin","doi":"10.1016/j.cap.2025.01.002","DOIUrl":null,"url":null,"abstract":"<div><div>Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag's exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the reliance on conventional adhesive layers. Among five chemical cleaning methods evaluated, immersion in concentrated H₂SO₄, followed by thorough rinsing with deionized water and ultrasonication in ethanol, emerged as the most effective. This method produced highly hydrophilic surfaces with a contact angle (CA) of 6.6°. The resulting Ag films, deposited via physical vapor deposition, demonstrated excellent adhesion without peeling, while also exhibiting smooth and uniform surfaces ideal for subsequent functionalization. By streamlining substrate preparation, this methodology enhances the fabrication efficiency of high-performance microelectronic devices, offering a practical and scalable solution for industrial applications.</div></div>","PeriodicalId":11037,"journal":{"name":"Current Applied Physics","volume":"71 ","pages":"Pages 138-143"},"PeriodicalIF":2.4000,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Current Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1567173925000033","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag's exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the reliance on conventional adhesive layers. Among five chemical cleaning methods evaluated, immersion in concentrated H₂SO₄, followed by thorough rinsing with deionized water and ultrasonication in ethanol, emerged as the most effective. This method produced highly hydrophilic surfaces with a contact angle (CA) of 6.6°. The resulting Ag films, deposited via physical vapor deposition, demonstrated excellent adhesion without peeling, while also exhibiting smooth and uniform surfaces ideal for subsequent functionalization. By streamlining substrate preparation, this methodology enhances the fabrication efficiency of high-performance microelectronic devices, offering a practical and scalable solution for industrial applications.
期刊介绍:
Current Applied Physics (Curr. Appl. Phys.) is a monthly published international journal covering all the fields of applied science investigating the physics of the advanced materials for future applications.
Other areas covered: Experimental and theoretical aspects of advanced materials and devices dealing with synthesis or structural chemistry, physical and electronic properties, photonics, engineering applications, and uniquely pertinent measurement or analytical techniques.
Current Applied Physics, published since 2001, covers physics, chemistry and materials science, including bio-materials, with their engineering aspects. It is a truly interdisciplinary journal opening a forum for scientists of all related fields, a unique point of the journal discriminating it from other worldwide and/or Pacific Rim applied physics journals.
Regular research papers, letters and review articles with contents meeting the scope of the journal will be considered for publication after peer review.
The Journal is owned by the Korean Physical Society.