One-year evaluation of microtensile bond strength of universal adhesives in Self-etch or Etch and Rinse modes to dentin groups at different caries-affected degree

IF 3.2 3区材料科学 Q2 ENGINEERING, CHEMICAL

International Journal of Adhesion and Adhesives Pub Date : 2024-12-07 DOI:10.1016/j.ijadhadh.2024.103919

Nurgul Cetin Tuncer, Cagatay Barutcugil

{"title":"One-year evaluation of microtensile bond strength of universal adhesives in Self-etch or Etch and Rinse modes to dentin groups at different caries-affected degree","authors":"Nurgul Cetin Tuncer, Cagatay Barutcugil","doi":"10.1016/j.ijadhadh.2024.103919","DOIUrl":null,"url":null,"abstract":"<div><h3>Purpose</h3><div>The immediate and long-term microtensile bond strengths of two current universal adhesives used in self-etch (SE) or etch and rinse (ER) mode to caries-affected dentin compared to sound dentin were investigated.</div></div><div><h3>Material and methods</h3><div>Dentin groups were identified using the Vickers microhardness test: control group (SD), caries-affected hard dentin (D1) and caries-affected semi-hard dentin (D2). Dentin-adhesive interfaces were examined by electron microscopy (SEM). Statistical analyses were performed using two-way ANOVA, Scheffé and independent <em>t</em>-test (p < 0.05).</div></div><div><h3>Results</h3><div>It was shown that the bond strength of all adhesive systems to D2 was significantly lower than to SD (p < 0.05) and that D1 exhibited bond strength similar to SD, especially for adhesives applied in SE modes.</div></div><div><h3>Conclusions</h3><div>According to the results of the study, dentin hardness, adhesive type and the application mode have an effect on the long-term bond strength to dentin.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"138 ","pages":"Article 103919"},"PeriodicalIF":3.2000,"publicationDate":"2024-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Adhesion and Adhesives","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0143749624003014","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}

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Abstract

Purpose

The immediate and long-term microtensile bond strengths of two current universal adhesives used in self-etch (SE) or etch and rinse (ER) mode to caries-affected dentin compared to sound dentin were investigated.

Material and methods

Dentin groups were identified using the Vickers microhardness test: control group (SD), caries-affected hard dentin (D1) and caries-affected semi-hard dentin (D2). Dentin-adhesive interfaces were examined by electron microscopy (SEM). Statistical analyses were performed using two-way ANOVA, Scheffé and independent t-test (p < 0.05).

Results

It was shown that the bond strength of all adhesive systems to D2 was significantly lower than to SD (p < 0.05) and that D1 exhibited bond strength similar to SD, especially for adhesives applied in SE modes.

Conclusions

According to the results of the study, dentin hardness, adhesive type and the application mode have an effect on the long-term bond strength to dentin.

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来源期刊

International Journal of Adhesion and Adhesives 工程技术-材料科学：综合

CiteScore

6.90

自引率

8.80%

发文量

200

审稿时长

8.3 months

期刊介绍： The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.