Research on the mechanical properties of CFRP-Al adhesively bonded structures in hygrothermal environments

IF 3.2 3区 材料科学 Q2 ENGINEERING, CHEMICAL
Shuhui Zhang , Zhebin Wu , Xiaodan Tang , Qihua Ma , Weiwen Cai , Xuehui Gan
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Abstract

Adhesive structures can provide connection strength without damaging the material and are important for connecting heterogeneous materials. This paper investigates the effects of different bonding parameters and hygrothermal environments on the mechanical properties and failure modes of CFRP-Al adhesively bonded structures. The results of the experiment indicate that the water absorption rate is directly proportional to the temperature of the water bath. Additionally, the ultimate tensile load of the samples decreased by 8.99 %, 22.58 %, and 42.97 % after being subjected to water baths at 25 °C, 50 °C, and 80 °C, respectively. This paper predicts the mechanical properties of CFRP-Al adhesive structures in hygrothermal environments using UMAT and USDFLD subroutines in ABAQUS finite element software. The accuracy of the simulation model is verified through comparison with experiments. On this basis, the effects of various bonding parameters (bonding length, thickness, width, and lay-up angle) on the mechanical properties and failure modes of CFRP-Al adhesively bonded structures in hygrothermal environments are studied, providing valuable insights for the design of dissimilar material joining techniques in complex environments.

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来源期刊
International Journal of Adhesion and Adhesives
International Journal of Adhesion and Adhesives 工程技术-材料科学:综合
CiteScore
6.90
自引率
8.80%
发文量
200
审稿时长
8.3 months
期刊介绍: The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.
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