TiCw/TiC ceramics composites: SPS preparation, thermal and mechanical properties

IF 3.9 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yongren Liang , Hua Jiao , Wendu Yang , Jiwei Feng , Qingxiang Wang , Kang Zhao
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Abstract

Plasma sintering (SPS) is an effective method for improving the strength and hardness properties of materials. A method for adding TiC whiskers is proposed to simultaneously enhance thermal and mechanical properties of TiC-based ceramic composites through discharge SPS technology. TiC whiskers (ranging from 0 to 5 wt%) were incorporated into commercial TiC-based ceramics as a reinforcement material. The results demonstrate that the addition of TiC whiskers significantly improves both the thermal and mechanical properties of the composites, with the material containing 5 wt% whiskers showing the best performance. Specifically, compared to the material without whisker addition, the flexural strength increased by 184.6 %, while the Vickers hardness reached 97.09 GPa, marking an increase of 194.7 %. The compressive strength achieved 532 MPa, and the Young’s modulus reached 14.67 GPa, representing increases of 188.0 % and 155.1 %, respectively. Furthermore, the inclusion of TiC whiskers also enhances thermal properties, with room temperature thermal diffusivity and thermal conductivity increasing by 12.9 % and 5.2 %, respectively, compared to the whisker-free material.

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来源期刊
Materials Science and Engineering: B
Materials Science and Engineering: B 工程技术-材料科学:综合
CiteScore
5.60
自引率
2.80%
发文量
481
审稿时长
3.5 months
期刊介绍: The journal provides an international medium for the publication of theoretical and experimental studies and reviews related to the electronic, electrochemical, ionic, magnetic, optical, and biosensing properties of solid state materials in bulk, thin film and particulate forms. Papers dealing with synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics are viewed as suitable for publication. Articles focused on nano-structured aspects of these advanced solid-state materials will also be considered suitable.
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