Yun Ouyang , Md Faisal Md Basir , Kohilavani Naganthran , Ioan Pop
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引用次数: 0
Abstract
In the die-slit process, unsteady MHD ternary nanofluid flow over a moving wedge helps enhance material quality and production efficiency. This study specifically examines unsteady MHD flow dynamics involving heat generation/absorption, viscous dissipation, and Ohmic heating effects, using a ternary nanofluid composed of -CuO-Cu/water over a moving wedge. Mathematical modeling and numerical computation analyze how heat generation/absorption impacts flow characteristics. Critical values for single and dual solutions are obtained using BVP4C in MATLAB, with dual solutions for leftward wedge motion and a single solution for rightward motion. Graphical results illustrate the influence of key parameters — involving the moving parameter, wedge parameter, Eckert number, magnetic parameter, heat source/sink parameter, and Darcy number — on flow dynamics and thermal transfer. The main results show that convective thermal transfer rises with larger values of the suction/injection parameter, unsteadiness parameter, Eckert number, and magnetic parameter, while it decreases during the rinsing process for the wedge angle parameter, Darcy number, and heat source/sink parameter. When the moving wedge parameter is −4, the heat transfer of THNF is 0.44% higher than NHF and 1.30% higher than NF. This study proposes a novel formulation for the time-varying permeability of a porous medium influenced by a moving wedge, offering valuable insights to enhance material properties, minimize waste, and improve precision in the extrusion process.
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