Highly-selective bandpass filter with enhanced stopband performance based on higher-order triple-mode folded-embedded single-cavity

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2025-02-01 DOI:10.1016/j.mejo.2025.106568

Hang Qian , De-Wei Zhang , Qing Liu , Xi Wang , Hai-Lin Deng , Hong-Hui Xu , Lin-Chuan Yang , Dong-Fang Zhou

引用次数: 0

Abstract

In this paper, a novel higher-order triple-mode single-cavity is proposed, which incorporates a quarter-mode substrate integrated waveguide (QMSIW) folded into a conventional SIW cavity, with connections established through vias. By focusing on controlling both resonant and non-resonant modes within the SIW cavity, several bandpass filters (BPFs) with enhanced stopband characteristics and high selectivity are proposed, combining two unique feed structures. For demonstration, two design examples are fabricated and measured, with all results showing good agreement, thereby validating the feasibility and universality of the proposed method. The proposed filters offer advantages such as high selectivity, an enhanced stopband, excellent group delay, and low insertion loss (IL), which broaden their application prospects and potential value.

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.