Jianyu Zhang , Yang Hua , Sichong Huang , Tongde Li , Liang Wang , Xing Zhang , Yuanfu Zhao
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引用次数: 0
Abstract
This study examines the radiation effects on FinFET devices in various space orbits utilizing Geant4 simulations. The impact of incident particles is assessed through the calculation of deposited energy in the oxide layer. By aggregating the radiation-induced energy deposition across all compositional elements, this research evaluates the effects of nine distinct orbital environments with varying incident energies and angles. The Geant4-derived energy deposition spectrum, combined with the orbital radiation model, facilitates a quantitative comparison of radiation effects on FinFET devices. The study ranks the orbits and their elements, identifying the most sensitive incident direction based on deposited energy. This quantitative evaluation method presents a novel approach for assessing space radiation effects on microelectronic devices with element-specific resolution.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.