A novel Ω-SOI Gate-All-Around FET with doping free load-Si and two-step wet etching achieving superior leakage suppression and short-channel effects immunity
IF 1.9 3区 工程技术Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Longyu Sun , Haoyan Liu , Xin Wang , Xiaofeng Jia , Jiayi Zhang , Yongliang Li
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引用次数: 0
Abstract
In this article, we proposed a novel 4-layer silicon-on-insulator (SOI) nanosheet (NS) Gate-All-Around (GAA) field-effect transistor (FET) with an Ω-structure (Ω-SOI). Through high-quality SiGe/Si multilayers epitaxy on the ground-plane (GP) doping free load-Si, and a two-step wet etching Ω-structure formation process, this novel Ω-SOI GAAFET was successfully fabricated, achieving threshold swing (SS), off-state current (Ioff), current ratio (Ion/Ioff), and drain-induced barrier lowering (DIBL) values of 65 mV/dec, 2.8 × 10−4 μA/μm, 3 × 106, and 7 mV/V, respectively. Moreover, 3D technology computer-aided design (TCAD) simulation was applied in advanced node, confirming that this novel Ω-SOI GAAFET can provide enhanced gate control capability than conventional SOI (C-SOI) GAAFET, leading to superior leakage suppression, and short-channel effects (SCE) immunity. This novel Ω-SOI GAAFET is compatible with the process flow of mainstream GAAFET, providing a promising candidate for extending CMOS technology.
期刊介绍:
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