Thermal conductivity of silica refractories and its temperature dependence during thermal cycling, compared to silicite and sandstone

IF 2.9 Q1 MATERIALS SCIENCE, CERAMICS
Lucie Kotrbová , Tereza Uhlířová , Willi Pabst , Jana Hubálková , Miroslav Kotouček
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引用次数: 0

Abstract

The thermophysical properties of silica refractories are important for their potential application as high-temperature thermal energy storage (HT-TES) media. In this paper, we report new measurements of thermal conductivity and thermal diffusivity by plane-source techniques and the laser-flash technique, respectively. The latter is also used to determine the temperature dependence of the thermal conductivity from room temperature to 800 °C during heating and cooling. It is shown that for a silica refractory with porosity 21 % the experimentally measured thermal conductivity (1.3–1.6 W/mK) is significantly lower than the analytical and numerical predictions for spherical, polyhedral and concave pores (3.1–4.7 W/mK), which indicates the influence of microcracks. The anomaly in the temperature dependence below ∼200 °C can be attributed to the phase transitions of cristobalite and tridymite, but above this temperature the thermal conductivity increases, whereas that of silicite and sandstone decreases. Thermal cycling leads to microcrack-induced damage.

Abstract Image

与硅石和砂岩相比,硅质耐火材料的导热性及其在热循环过程中的温度依赖性
二氧化硅耐火材料的热物理性质对其作为高温储热介质的潜在应用具有重要意义。在本文中,我们分别报道了用平面源技术和激光闪光技术测量热导率和热扩散率的新方法。后者也用于确定在加热和冷却过程中从室温到800°C的导热系数的温度依赖性。结果表明,对于孔隙率为21%的硅石耐火材料,实验测量的导热系数(1.3 ~ 1.6 W/mK)明显低于球形孔、多面体孔和凹孔的解析和数值预测值(3.1 ~ 4.7 W/mK),这表明微裂纹的影响。在~ 200℃以下的温度依赖性异常可归因于方石英和钇石的相变,但在此温度以上,热导率增加,而硅石和砂岩的热导率降低。热循环导致微裂纹损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Open Ceramics
Open Ceramics Materials Science-Materials Chemistry
CiteScore
4.20
自引率
0.00%
发文量
102
审稿时长
67 days
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