High-speed wafer-level TGV interposer for 2.5D CPO

IF 2.2 3区物理与天体物理 Q2 OPTICS

Optics Communications Pub Date : 2025-01-20 DOI:10.1016/j.optcom.2025.131517

Chang Ge , Xinyi Wang , Jiangbing Du , Xiaozhong Lin , Ting Lei , Luping Du , Zuyuan He

引用次数: 0

Abstract

This paper presents the development of an 8-inch wafer-level TGV interposer, highlighting its potential for CPO applications. Fabricated using Laser-Induced Deep Etching (LIDE) and metallization, the TGV interposer demonstrated a bandwidth of 110 GHz and supported a 128-Gbaud On- Off Keying (OOK) signal interconnection, verified through both simulations and experimental methods. The research underscores the feasibility of 2.5D packaging by utilizing flip-chip technology to integrate driver and Electro- Absorption Modulated Laser (EML) chips onto the TGV interposer. The op-to electronic joint testing confirmed the EML's operational viability, achieving an optical output power of −0.07 dBm. This study illustrates advancements in TGV interposer technologies for high-performance optical communication systems.

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来源期刊

Optics Communications 物理-光学

CiteScore

5.10

自引率

8.30%

发文量

681

审稿时长

38 days

期刊介绍： Optics Communications invites original and timely contributions containing new results in various fields of optics and photonics. The journal considers theoretical and experimental research in areas ranging from the fundamental properties of light to technological applications. Topics covered include classical and quantum optics, optical physics and light-matter interactions, lasers, imaging, guided-wave optics and optical information processing. Manuscripts should offer clear evidence of novelty and significance. Papers concentrating on mathematical and computational issues, with limited connection to optics, are not suitable for publication in the Journal. Similarly, small technical advances, or papers concerned only with engineering applications or issues of materials science fall outside the journal scope.