A mini review on contamination control in ultrapure liquids for semiconductor manufacturing – From the perspective of liquid-solid interfaces

Abstract

The contamination control in ultrapure liquids for integrated circuit manufacturing is becoming increasingly important as the technology node reaches 10 nm and beyond. The particles, metals, ions, bacteria, and undesired organic compounds need to be strictly controlled via the liquid processing devices such as degassing, TOC degradation, ion exchange, and terminal filtration and purification. In this mini review, we summarize the contamination control processes in these liquid processing devices from the perspective of liquid-solid interfaces involved in the removal or capture of the corresponding micro contaminants. We also propose the key points and promising directions of future developments of the liquid contamination control methods for the semiconductor industry.