Microstructure and hardness properties for laser powder directed energy deposition cladding of Inconel 718 on electron beam powder-bed fusion fabricated Inconel 625 substrates: As-built and post-process heat treated

D. Garcia , K.I. Watanabe , L. Marquez , E. Arrieta , L.E. Murr , R.B. Wicker , F. Medina
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Abstract

Laser powder directed energy deposition (LP-DED) additive manufacturing (AM) deposited Inconel 718 claddings (at laser power levels of 800, 1000, and 1200 W) onto Inconel 625 substrates fabricated by electron beam powder-bed fusion (EB-PBF). The cladding components were post-process heat treated for 1 h at temperatures of 1025 °C, 1175 °C, and 1250 °C. The microstructures and Vickers hardnesses were examined and compared for the as-built and heat treated cladding components. As-built claddings consisted of columnar dendrites and precipitate columns while the heat-treated microstructures consisted of varying degrees of recrystallization and grains containing {111} fcc annealing twins. The as-built cladding bond consisted of a 25–50 μm wide transition zone while the heat treated cladding bonds consisted primarily of linked grain boundaries sometimes alternating between the Inconel 718 alloy cladding and the Inconel 625 substrate. For the as-built components, the hardness increased from the Inconel 625 substrate to the Inconel 718 cladding. For the heat treated components, the hardness for the Inconel 718 cladding was lessened with increasing heat treatment temperature, but was overall similar to the Inconel 625 substrate.
电子束粉末床熔合制备Inconel 625基板上激光粉末定向能熔覆Inconel 718的显微组织和硬度性能:初铸和后处理
激光粉末定向能沉积(LP-DED)增材制造(AM)在电子束粉末床熔合(EB-PBF)制造的Inconel 625衬底上沉积了Inconel 718包层(激光功率水平为800、1000和1200 W)。包层组件分别在1025℃、1175℃和1250℃下后处理热处理1 h。对预制和热处理后的熔覆件进行了显微组织和维氏硬度的检测和比较。构建包层由柱状枝晶和析出柱组成,而热处理后的组织由不同程度的再结晶和含有{111}fcc退火孪晶的晶粒组成。构建的包层键由25-50 μm宽的过渡区组成,而热处理的包层键主要由连接的晶界组成,有时在Inconel 718合金包层和Inconel 625基体之间交替。对于成品部件,硬度从Inconel 625基材增加到Inconel 718包层。对于热处理部件,随着热处理温度的升高,Inconel 718熔覆层的硬度降低,但总体上与Inconel 625熔覆层硬度相近。
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CiteScore
5.30
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