Hot deformation behaviour, constitutive equations and processing map of Cu-Zn-Al-Ni shape memory alloy

Kenneth Kanayo Alaneme , Sodiq Abiodun Kareem , Justus Uchenna Anaele , Michael Oluwatosin Bodunrin
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Abstract

The hot workability and deformation behaviour of Cu-Zn-Al-Ni based shape memory alloy (SMA) was investigated. The alloy was isothermal compression tested at temperatures of 250–550 °C, strain rates of 0.1–5 s−1, and a constant total strain of 0.5, using a thermomechanical Gleeble-3500 simulator. The results show that positive strain rate sensitivity characterized the plastic flow behaviour of the SMA. The hyperbolic-sine constitutive equation - determined activation energy for the hot deformation of Cu-Zn-Al-Ni SMA (154.34 kJ/mol) is about 24 % lower than the activation energy for self-diffusion of copper, and that of the stress exponent value (n) which was less than 5, both point to dynamic recrystallization to be the dominant dynamic softening mechanism. Furthermore, the processing map indicated that flow instability occurs in the low temperature and strain rate regions (250 - 350 °C, 0.1 – 5s−1) with characteristic shear bands, dendritic structures, and micro-cracks in their microstructure. The temperature of 550 °C and strain rates of between 0.1 and 2.5 s−1, was established to be the optimal condition for hot deformation of the alloy. These conditions result in stable flow with microstructures consisting of fine dynamically recrystallized grains.
Cu-Zn-Al-Ni形状记忆合金的热变形行为、本构方程及加工图
研究了Cu-Zn-Al-Ni基形状记忆合金(SMA)的热加工性能和变形行为。采用热机械Gleeble-3500模拟机,在温度为250 ~ 550℃,应变速率为0.1 ~ 5 s−1,总应变恒定为0.5的条件下对合金进行等温压缩测试。结果表明,SMA的塑性流动行为具有正应变率敏感性。由双曲正弦本构方程确定的Cu-Zn-Al-Ni SMA热变形活化能(154.34 kJ/mol)比铜自扩散活化能低24%左右,且应力指数值(n)小于5,均表明动态再结晶是主要的动态软化机制。此外,加工图表明,在低温和应变速率区域(250 ~ 350℃,0.1 ~ 5s−1)出现了流动不稳定性,其组织中存在典型的剪切带、枝晶结构和微裂纹。温度为550℃,应变速率为0.1 ~ 2.5 s−1,是合金热变形的最佳条件。这些条件导致流动稳定,微观组织由细小的动态再结晶晶粒组成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
5.30
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