{"title":"Study of GaN Schottky barrier IMPATT diodes with a self-aligned field plate for terahertz applications","authors":"Xuan Huang, Lin-An Yang, Jian-Hua Zhou, Xin-Yi Wang, Xiao-Hua Ma, Yue Hao","doi":"10.1016/j.mejo.2025.106572","DOIUrl":null,"url":null,"abstract":"<div><div>This article investigates a self-aligned field plate to enhance the GaN Schottky barrier IMPATT diodes at the low-frequency end of the terahertz regime by restraining the electric field at the Anode edge to reach uniform avalanche inside the Anode. Simulation results demonstrate an improved device tolerance, a conversion power of 2.8 times larger and a conversion efficiency of 4.4 times higher than those of the none field plate, respectively, and a 1.31 times conversion efficiency of the ordinary field plate at the optimum frequency of 120 GHz, achieving 64 % of ideal conversion power and 86 % of ideal efficiency. Meanwhile, the initiating-oscillation efficiency of the self-aligned field plate is improved by 7.5 and 0.6 times at 120 GHz compared to that of the none and ordinary field plates, respectively, with speed exceeding 8.7 and 2.1 times that of the none and ordinary field plates to initiate oscillation. Furthermore, the self-aligned field plate provides the working bandwidth in 68–223 GHz, approaching that of the ideal.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"157 ","pages":"Article 106572"},"PeriodicalIF":1.9000,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125000219","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article investigates a self-aligned field plate to enhance the GaN Schottky barrier IMPATT diodes at the low-frequency end of the terahertz regime by restraining the electric field at the Anode edge to reach uniform avalanche inside the Anode. Simulation results demonstrate an improved device tolerance, a conversion power of 2.8 times larger and a conversion efficiency of 4.4 times higher than those of the none field plate, respectively, and a 1.31 times conversion efficiency of the ordinary field plate at the optimum frequency of 120 GHz, achieving 64 % of ideal conversion power and 86 % of ideal efficiency. Meanwhile, the initiating-oscillation efficiency of the self-aligned field plate is improved by 7.5 and 0.6 times at 120 GHz compared to that of the none and ordinary field plates, respectively, with speed exceeding 8.7 and 2.1 times that of the none and ordinary field plates to initiate oscillation. Furthermore, the self-aligned field plate provides the working bandwidth in 68–223 GHz, approaching that of the ideal.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.