Comparative analysis of heat transfer enhancement in nucleate pool boiling using different fin geometries

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Keyhan Kouzegar Ghiyasi, Siamak Hossainpour
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引用次数: 0

Abstract

This study investigates the effect of surface geometry on nucleate pool boiling heat transfer, focusing on smooth, rectangular finned, and trapezoidal finned surfaces. Using the Volume of Fluid (VOF) method in a two-dimensional numerical analysis, the research provides comprehensive insights into bubble dynamics, including nucleation, growth, detachment, and liquid–vapor interactions. The study shows good agreement between the numerical model results and experimental data, confirming the accuracy and reliability of the VOF method in simulating complex boiling phenomena. The results indicate that finned surfaces significantly enhance heat transfer compared to smooth surfaces, with trapezoidal fins demonstrating the best performance. Trapezoidal fins improved by 133% in the heat transfer coefficient (HTC) and 210% in heat flux compared to smooth surfaces, attributed to their optimized geometry that enhances bubble dynamics and thermal efficiency. Rectangular fins also showed sensitivity to fin height and spacing changes, with improvements of up to 95% in HTC and 150% in heat flux. This study provides practical guidelines for designing advanced heat transfer surfaces, with significant applications in thermal management systems for industries such as power generation, cooling systems, and electronics.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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