Experimental study on thermal performance of a single-phase immersion cooling unit for high-density computing power data center

IF 2.6 3区工程技术 Q2 ENGINEERING, MECHANICAL

International Journal of Heat and Fluid Flow Pub Date : 2024-12-25 DOI:10.1016/j.ijheatfluidflow.2024.109735

Xinshan Sun, Zhan Liu, Shenrui Ji, Kaifeng Yuan

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引用次数: 0

Abstract

Traditional air-cooling systems cannot meet special requirements of high-density computing power data centers (DCs). The single-phase immersion cooling (SPIC) is considered as one of the best ways to effectively cool high-density computing power DC cabinets. In this study, a SPIC unit was experimentally investigated with dielectric fluid Noah 3000D under a designed heat load of 20 kW. The impact of the cooling water flow rate q_v₂ on the thermal characteristics, flow resistance and power consumption of the SPIC unit were investigated. The results show that the temperatures of both the coolant and cooling water decrease with the increase of q_v₂, but the temperature difference of coolant increases with the increase of q_v₂. An increase in coolant temperature difference means an increase in temperature non-uniformity. The increase in q_v₂ also leads to an increase in system flow resistance. In this experiment, the pressure loss of the heat exchanger and pipelines on the coolant side, account for about 56 % and 44 %, respectively. The power usage effectiveness of the cooling system in DC (cPUE) and coefficient of performance (COP) of the SPIC unit vary in the range of 1.08–1.09 and 5.69–7.21, respectively. Moreover, it is found that simply increasing q_v₂ cannot significantly improve the heat exchange of SPIC units, but will increase system’s energy consumption to a certain extent. The present study mainly focuses on the laboratory experimental test on the SPIC unit, and the related conclusions are significant to the design and operation of SPIC units in high-density computing power DCs.

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来源期刊

International Journal of Heat and Fluid Flow 工程技术-工程：机械

CiteScore

5.00

自引率

7.70%

发文量

131

审稿时长

33 days

期刊介绍： The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.