Frank G. Jacobitz , Ian Sysyn , Jacob Ryan , Jack Comfort , Patrick Bonner , Dylan Poole , Jonathan Lemarechal , Marco Costantini
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引用次数: 0
Abstract
The aim of this study is a direct comparison of experimental and simulation results of two flows, a laminar boundary layer developing on a flat heated plate and the interaction of a laminar boundary layer with a single cylindrical roughness element of small aspect ratio with a height similar to the boundary layer thickness. The experiments were performed in a water channel using temperature-sensitive paint (TSP) on a heated flat plate on which the boundary layer develops. The numerical simulations are meant to complement the experimental data, allowing for a direct comparison with the experiment and adding additional information not easily accessible from the experiment. In the case of the laminar boundary layer developing over a flat heated surface, experimental TSP measurements and simulation results of the surface temperature show strong agreement and a correlation coefficient for the two temperature fields of 0.99 is obtained. In the case of a laminar boundary layer interacting with a low aspect ratio roughness element, the comparison between experimental and numerical data revealed the role played by buoyancy effects even at the small implemented temperature differences between surface and fluid. With consideration of buoyancy in the simulations, again good agreement between the experimental and simulation results is obtained with a correlation coefficient of 0.95 for the respective temperature fields. The complex vortical system identified in the flow field via the simulations was shown to be consistent with the thermal footprints measured on the heated wall in the experiments.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.