{"title":"A scalable 3–15 GHz 256-element active phased array for ultra-wideband multi-functional RF sensor systems","authors":"Daqun Yu, Jian Mi, Zhuo-Wei Miao, Zhang-Cheng Hao","doi":"10.1049/ell2.70142","DOIUrl":null,"url":null,"abstract":"<p>This letter presents a 256-element ultra-wideband active phased array tile spanning 3–15 GHz. The array employs Vivaldi antennas arranged in a triangular lattice, optimizing the T/R module count. The ultra-wideband T/R module, based on system-in-package (SiP) technology, integrates power amplifiers, low-noise amplifiers, and multifunctional chips. A prototype was fabricated and measured, with the active layer, including T/R modules, having a thickness of just 8.4 mm. Measured results show a scanning range of ±60° at 10 GHz, ±15° at 13 GHz, and ±5° at 15 GHz, with an instantaneous bandwidth of 1.0 GHz. The prototype achieves 49 dB W EIRP and 1.3 dB/K <i>G</i>/<i>T</i> at 10 GHz, and 5.21% EVM for a 64-QAM modulated signal. These results establish the array as a viable solution for cost-effective, scalable, ultra-wideband multi-functional RF sensor systems.</p>","PeriodicalId":11556,"journal":{"name":"Electronics Letters","volume":"61 1","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2025-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/ell2.70142","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronics Letters","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/ell2.70142","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This letter presents a 256-element ultra-wideband active phased array tile spanning 3–15 GHz. The array employs Vivaldi antennas arranged in a triangular lattice, optimizing the T/R module count. The ultra-wideband T/R module, based on system-in-package (SiP) technology, integrates power amplifiers, low-noise amplifiers, and multifunctional chips. A prototype was fabricated and measured, with the active layer, including T/R modules, having a thickness of just 8.4 mm. Measured results show a scanning range of ±60° at 10 GHz, ±15° at 13 GHz, and ±5° at 15 GHz, with an instantaneous bandwidth of 1.0 GHz. The prototype achieves 49 dB W EIRP and 1.3 dB/K G/T at 10 GHz, and 5.21% EVM for a 64-QAM modulated signal. These results establish the array as a viable solution for cost-effective, scalable, ultra-wideband multi-functional RF sensor systems.
期刊介绍：
Electronics Letters is an internationally renowned peer-reviewed rapid-communication journal that publishes short original research papers every two weeks. Its broad and interdisciplinary scope covers the latest developments in all electronic engineering related fields including communication, biomedical, optical and device technologies. Electronics Letters also provides further insight into some of the latest developments through special features and interviews.
Scope
As a journal at the forefront of its field, Electronics Letters publishes papers covering all themes of electronic and electrical engineering. The major themes of the journal are listed below.
Antennas and Propagation
Biomedical and Bioinspired Technologies, Signal Processing and Applications
Control Engineering
Electromagnetism: Theory, Materials and Devices
Electronic Circuits and Systems
Image, Video and Vision Processing and Applications
Information, Computing and Communications
Instrumentation and Measurement
Microwave Technology
Optical Communications
Photonics and Opto-Electronics
Power Electronics, Energy and Sustainability
Radar, Sonar and Navigation
Semiconductor Technology
Signal Processing
MIMO
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