Impact of Sample Preparation Approach on Transmission Electron Microscopy Investigation of Sputtered AlNi Multilayers Used for Reactive Soldering

Abstract

Sputtered AlNi Multilayers

In article number 2302215, Juan Jesús Jiménez and co-workers show that preparation methods have crucial influence on transmission electron microscopy results when investigating the intermixing between Al and Ni in reactive multilayers. The comparison of three lamella preparation methods shows that Xe-based FIB leads to low contamination, although Ga-FIB is a good alternative. This outcome presents an important aspect for the investigation of self-sustaining reactions on nanostructures and rough surfaces.