{"title":"A low-cost MMC submodule topology with fast DC fault handling capability","authors":"Yiqi Liu, Laicheng Yin, Zhaoyu Duan, Zhenjie Li, Mingfei Ban, Jiawei Zhang","doi":"10.1049/pel2.12846","DOIUrl":null,"url":null,"abstract":"<p>With the continuous development of new energy technologies and the widespread application of high voltage direct current transmission technology, the use of modular multilevel converters (MMC) has significantly increased. Traditional MMCs, composed of half-bridge submodules, lack fault handling capabilities, and cannot block fault currents on the DC side, thus compromising the stability of transmission systems. Therefore, this study proposes a low-cost improved MMC submodule topology based on the dual-bidirectional switch submodule (DBSSM) and provides an analysis and description of its structure and operating principles. The proposed DBSSM structure can output five voltage levels: 0, ± Uc, and ±2 Uc. Compared to the full-bridge submodule topology, which achieves the same effect, the DBSSM reduces the number of IGBTs by half, significantly lowering hardware costs. A simulation model with a DC side voltage of 80 kV was built using MATLAB/Simulink to verify this topology. In the 80 kV scenario, the proposed DBSSM achieved DC fault ride-through within 3 ms, doubling the speed compared to the full-bridge submodule. Finally, hardware-in-the-loop testing was performed using the dSPACE1202 and relevant hardware circuits, confirming the feasibility of the proposed structure.</p>","PeriodicalId":56302,"journal":{"name":"IET Power Electronics","volume":"18 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/pel2.12846","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/pel2.12846","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
With the continuous development of new energy technologies and the widespread application of high voltage direct current transmission technology, the use of modular multilevel converters (MMC) has significantly increased. Traditional MMCs, composed of half-bridge submodules, lack fault handling capabilities, and cannot block fault currents on the DC side, thus compromising the stability of transmission systems. Therefore, this study proposes a low-cost improved MMC submodule topology based on the dual-bidirectional switch submodule (DBSSM) and provides an analysis and description of its structure and operating principles. The proposed DBSSM structure can output five voltage levels: 0, ± Uc, and ±2 Uc. Compared to the full-bridge submodule topology, which achieves the same effect, the DBSSM reduces the number of IGBTs by half, significantly lowering hardware costs. A simulation model with a DC side voltage of 80 kV was built using MATLAB/Simulink to verify this topology. In the 80 kV scenario, the proposed DBSSM achieved DC fault ride-through within 3 ms, doubling the speed compared to the full-bridge submodule. Finally, hardware-in-the-loop testing was performed using the dSPACE1202 and relevant hardware circuits, confirming the feasibility of the proposed structure.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf