Study of oxygen diffusion and oxidation of silver alloys for Bi-2223 and their effect on tape fabrication

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xueqian Liu, Zesheng Zhou, Jianfeng Li, Shengnan Zhang, Heng Li, Yanfeng Yang, Lihua Jin, Qingbin Hao, JianQing Feng, Chengshan Li, Pingxiang Zhang
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引用次数: 0

Abstract

Silver and silver alloys are essential sheathing materials for Bi2Sr2Ca2Cu3O10+δ (Bi-2223) superconducting tapes, due to their oxygen permeability, workability, and chemical compatibility with the highly reactive Bi-2223 powder. Alloying elements can enhance material strength, but oxidation triggered by oxygen diffusion during fabrication process affects their chemical and mechanical properties. This study investigates the oxygen diffusion and internal oxidation behavior of AgMg, AgMgNi, and AgMn alloys, which are commonly used as sheathing materials for Bi-2223 tapes. The oxygen diffusion kinetics of these alloys were analyzed under various temperatures and oxygen partial pressures to determine their diffusion rates and their effects on microstructure. The results indicate that AgMg-based alloys exhibit higher oxidation rates than AgMn, primarily due to the reactivity of Mg, which leads to significant mechanical strengthening but reduced ductility after complete oxidation. Oxidant precipitates observed at grain boundaries was found to influence the tensile behavior of the alloys. Moreover, Bi-2223 tapes fabricated with AgMg-based sheaths exhibited notable surface defects and reduced plasticity, particularly after heat treatment and intermediate rolling processes, attributed to the formation of MgO and CuO precipitates, which also altered the Cu content within the filament during heat treatment. These findings suggest that while AgMg-based alloys offer mechanical advantages, their oxidation characteristics may pose challenges in maintaining tape integrity during fabrication. It is essential to further optimize alloy compositions and processing conditions to achieve the best possible performance in superconducting tapes.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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