Study on the properties of epoxy insulating materials degradation and recycled materials based on 2,4,6-tris(dimethylaminomethyl)phenol catalyzed transesterification reaction

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-04 DOI:10.1007/s10854-025-14303-2

Yuxin Duan, Yaqi Gan, Chao Gao, Jiahe Yu, Yao Zheng, Xiaoxing Zhang, Yunjian Wu

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引用次数: 0

Abstract

Epoxy resin is widely used as an insulating material for electric equipment and electronics due to its superior insulating properties and physicochemical properties. However, the insoluble and non-fusible three-dimensional network structure formed after curing leads to difficulties in recycling, resulting in waste of resources and environmental pollution. In this paper, 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) was utilized as a catalyst to accelerate the curing of bisphenol A diglycidyl ether (DGEBA) by glutaric anhydride (GA) to obtain an epoxy insulating material. The degradation of this epoxy was achieved using ethylene glycol (EG) under 180 ℃ in 2 h. The performance test shows that the composite epoxy resin has a dielectric constant of 3.075 and a dielectric loss of 0.02, which is similar to that of the original epoxy resin. At the same time, the breakdown field strength of the re-prepared epoxy resin insulation material is as high as 38.66 kV/mm, which is 8.1% higher than the 35.76 kV/mm of the original epoxy resin. However, thermogravimetric analysis showed a slight decrease in thermal stability. These results provide important technical support for the efficient recycling of epoxy insulation materials.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.