Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors

Mohammed Hadhi Pazhaya Puthanveettil;Manvendra Singh;Siri Chandana Amarakonda;Subho Dasgupta
{"title":"Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors","authors":"Mohammed Hadhi Pazhaya Puthanveettil;Manvendra Singh;Siri Chandana Amarakonda;Subho Dasgupta","doi":"10.1109/JFLEX.2025.3526083","DOIUrl":null,"url":null,"abstract":"The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin-film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-D nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using nonlinear ac electric fields. In this study, high-hole mobility tellurium nanowires are assembled using nonlinear ac dielectrophoresis to fabricate electrolyte-gated TFTs (EG-TFTs) on a flexible substrate at room temperature. These p-type flexible transistors exhibit an on-off ratio of <inline-formula> <tex-math>$3.3\\times 10^{2}$ </tex-math></inline-formula>, an ON-current density of 20 <inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>A <inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>m−1, a specific transconductance of 8.5 <inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>S <inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>m−1, and linear mobility of 20.6 cm2 V−1 s−1 with adequate mechanical strain tolerance.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"3 10","pages":"454-460"},"PeriodicalIF":0.0000,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Flexible Electronics","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10824782/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin-film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-D nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using nonlinear ac electric fields. In this study, high-hole mobility tellurium nanowires are assembled using nonlinear ac dielectrophoresis to fabricate electrolyte-gated TFTs (EG-TFTs) on a flexible substrate at room temperature. These p-type flexible transistors exhibit an on-off ratio of $3.3\times 10^{2}$ , an ON-current density of 20 $\mu $ A $\mu $ m−1, a specific transconductance of 8.5 $\mu $ S $\mu $ m−1, and linear mobility of 20.6 cm2 V−1 s−1 with adequate mechanical strain tolerance.
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