A Weakly Coupled Tuning Fork MEMS Electric Field Sensor With High Resolution and Wide Measurement Range

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2024-12-30 DOI:10.1109/JMEMS.2024.3518622

Guijie Wang;Shenglin Hou;Lifang Ran;Jianhua Li;Bo Zhang;Xiaolong Wen;Najib Kacem;Ashwin A. Seshia

{"title":"A Weakly Coupled Tuning Fork MEMS Electric Field Sensor With High Resolution and Wide Measurement Range","authors":"Guijie Wang;Shenglin Hou;Lifang Ran;Jianhua Li;Bo Zhang;Xiaolong Wen;Najib Kacem;Ashwin A. Seshia","doi":"10.1109/JMEMS.2024.3518622","DOIUrl":null,"url":null,"abstract":"High-resolution and sensitive MEMS DC electric field sensors offer the possibility for the integration of detection in multiple fields, such as atmospheric electricity, power grids and biomedical sciences. In this work, a mode-localized sensor prototype based on a double-ended tuning fork design (DETF) is presented. The theoretical derivations and lumped model simulations reveal the key performance enhancements regarding the wide measurement range and high resolution of such a coupled resonator structure. A prototype is fabricated using Silicon-On-insulator (SOI) approaches, which is further tested to achieve a sensitivity of 0.016/(kV/m), a resolution of 21.3 V/m, a measurement range of 200kV/m and a bias instability of 0.29 V/m. The metrics are improved compared to the traditional Euler beam designs and the micro-machined counterparts. This shows the capability to meet the demands for electric field sensing in modern atmospheric electricity, power grids and biomedical sciences, with enhanced sensitivity, measurement range and stability.[2024-0154]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"82-91"},"PeriodicalIF":2.5000,"publicationDate":"2024-12-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10817782/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

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Abstract

High-resolution and sensitive MEMS DC electric field sensors offer the possibility for the integration of detection in multiple fields, such as atmospheric electricity, power grids and biomedical sciences. In this work, a mode-localized sensor prototype based on a double-ended tuning fork design (DETF) is presented. The theoretical derivations and lumped model simulations reveal the key performance enhancements regarding the wide measurement range and high resolution of such a coupled resonator structure. A prototype is fabricated using Silicon-On-insulator (SOI) approaches, which is further tested to achieve a sensitivity of 0.016/(kV/m), a resolution of 21.3 V/m, a measurement range of 200kV/m and a bias instability of 0.29 V/m. The metrics are improved compared to the traditional Euler beam designs and the micro-machined counterparts. This shows the capability to meet the demands for electric field sensing in modern atmospheric electricity, power grids and biomedical sciences, with enhanced sensitivity, measurement range and stability.[2024-0154]

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一种高分辨率宽测量范围弱耦合音叉MEMS电场传感器

高分辨率和敏感的MEMS直流电场传感器为大气电力、电网和生物医学科学等多个领域的集成检测提供了可能性。本文提出了一种基于双端音叉设计（DETF）的模式局部化传感器原型。理论推导和集总模型仿真揭示了该耦合谐振器结构在宽测量范围和高分辨率方面的关键性能增强。采用绝缘体上硅（SOI）方法制作了样机，进一步测试了其灵敏度为0.016/(kV/m)，分辨率为21.3 V/m，测量范围为200kV/m，偏置不稳定性为0.29 V/m。与传统的欧拉梁设计和微加工梁设计相比，这些指标得到了改进。这显示了满足现代大气电力，电网和生物医学科学对电场传感需求的能力，具有更高的灵敏度，测量范围和稳定性。[2024-0154]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.