{"title":"Design of high suppression filter for millimeter-wave using glass-based advanced package integrated technology","authors":"Yanzhu Qi, Yazi Cao, Shichang Chen, Gaofeng Wang","doi":"10.1016/j.mejo.2025.106567","DOIUrl":null,"url":null,"abstract":"<div><div>A high-selective millimeter-wave bandpass filter (BPF) utilizing folded-line coupling resonator (FLCR) is presented. This BPF consists of four unitized FLCRs, which are realized by redistribution layer (RDL) on a glass interposer. There are electric and magnetic couplings among the resonators. By parameterizing the size and couplings of the FLCRs, the passband and four TZs can be readily controlled. To illustrate the operational principle, an equivalent circuit of the FLCRs is proposed and discussed. To validate the design, the BPF prototype working at 20.7 GHz is designed and fabricated. The measured results show that the designed BPF can achieve a 3-dB fractional bandwidth of 17.3 %. Moreover, the designed BPF exhibits a roll-off of 18.68 dB/GHz in the low sideband and a roll-off of 10.76 dB/GHz in the high sideband, thereby producing sharp-rejection filtering. In addition, it can achieve more than 36 dB of suppression from 0 to 14.6 GHz and more than 30 dB from 24.5 to 38.5 GHz. The fabricated BPF has a compact size of 1.73 mm × 1.1 mm (0.242 λg × 0.154 λg).</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"157 ","pages":"Article 106567"},"PeriodicalIF":1.9000,"publicationDate":"2025-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125000165","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A high-selective millimeter-wave bandpass filter (BPF) utilizing folded-line coupling resonator (FLCR) is presented. This BPF consists of four unitized FLCRs, which are realized by redistribution layer (RDL) on a glass interposer. There are electric and magnetic couplings among the resonators. By parameterizing the size and couplings of the FLCRs, the passband and four TZs can be readily controlled. To illustrate the operational principle, an equivalent circuit of the FLCRs is proposed and discussed. To validate the design, the BPF prototype working at 20.7 GHz is designed and fabricated. The measured results show that the designed BPF can achieve a 3-dB fractional bandwidth of 17.3 %. Moreover, the designed BPF exhibits a roll-off of 18.68 dB/GHz in the low sideband and a roll-off of 10.76 dB/GHz in the high sideband, thereby producing sharp-rejection filtering. In addition, it can achieve more than 36 dB of suppression from 0 to 14.6 GHz and more than 30 dB from 24.5 to 38.5 GHz. The fabricated BPF has a compact size of 1.73 mm × 1.1 mm (0.242 λg × 0.154 λg).
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.