Universal in situ supersaturated crystallization enables 3D printable afterglow hydrogel

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Shuman Zhang, Yunliang Ji, Shiyi Chen, Siming Chen, Dongjie Xiao, Cheng Chen, Guangyao Guo, Mingjian Zeng, Weiguang Wang, Jingyu Zhang, Hui Li, Ye Tao, Gaozhan Xie, Huanhuan Li, Yizhou Zhang, Runfeng Chen, Wei Huang
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引用次数: 0

Abstract

Stretchable afterglow materials have garnered widespread attention owing to their unique combination of optical properties and mechanical flexibility. However, achieving a crystal environment to suppress the non-radiative transition of triplet excitons poses a challenge in constructing stretchable afterglow materials. Herein, we utilize an in situ supersaturated crystallization strategy to form afterglow microcrystals within a hydrogel matrix. This approach enables afterglow emission with a lifetime of 695 ms while maintaining high stretchability with tensile stress surpassing 398 kPa, extensibility over 400% and a high water content of 65.21%. Moreover, the universal supersaturated crystallization strategy allows for conferring tunable afterglow performance. Successful demonstrations in hydrogel 3D printing and anti-counterfeiting purposes showcase the potential for advanced applications of 3D printable afterglow hydrogels. This investigation provides guidelines for generally designing efficient afterglow hydrogels and addresses the inherent contradiction between flexibility and rigid in stretchable afterglow materials.

Abstract Image

通用原位过饱和结晶使3D打印余辉水凝胶
可拉伸余辉材料由于其独特的光学性能和机械柔韧性的结合而引起了广泛的关注。然而,如何在晶体环境中抑制三重态激子的非辐射跃迁,对构建可拉伸余辉材料提出了挑战。在此,我们利用原位过饱和结晶策略在水凝胶基质中形成余辉微晶体。这种方法可以使余辉发射寿命达到695 ms,同时保持高拉伸性,拉伸应力超过398 kPa,拉伸率超过400%,含水量高达65.21%。此外,通用过饱和结晶策略允许赋予可调的余辉性能。水凝胶3D打印和防伪目的的成功演示展示了3D打印余辉水凝胶的先进应用潜力。该研究为设计高效的余辉水凝胶提供了指导,并解决了可拉伸余辉材料的柔性和刚性之间的内在矛盾。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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