Effects of temperature on stress response and deformation mechanism in tensile of wire arc additively manufactured 2319 alloy

IF 5.8 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Jinsheng Ji, Feiyue Lyu, Yuchi Fang, Leilei Wang, Xiaohong Zhan
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引用次数: 0

Abstract

Wire arc additive manufacturing technology has been widely applicated in the manufacturing of large-scale aerospace components. Hence, conducting research on the operating conditions of additively manufactured components in extreme environments is essential. Nonetheless, research on the high-temperature tensile behavior of as-deposited 2319 alloy is currently insufficient. This paper shifts from assessing the alloy's performance at high temperatures to investigating the mechanisms during hot deformation for potential application in processing methods. The results indicated that the increasing temperature weakened the work-hardening for the lower strength and higher elongation. Heat treatment contributed to the better performance in high-temperature tensile. Dynamic recovery was greatly activated with temperature increasing. At 200℃, insufficient heat input led to grain refinement in CDRX and DDRX, accompanied by the formation of abundant sub-grain boundaries. Besides, due to the left phases at grain boundaries, TDRX was activated in the deposited alloy. At 400℃, higher temperature dissolved phase, providing a thermal driving force and space for recrystallized grains growth to enhance elongation. The results of this study provide valuable insights for the high-temperature performance of wire arc additive manufacturing components.
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来源期刊
Journal of Alloys and Compounds
Journal of Alloys and Compounds 工程技术-材料科学:综合
CiteScore
11.10
自引率
14.50%
发文量
5146
审稿时长
67 days
期刊介绍: The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.
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