Enhancing the thermal conductivity of epoxy molding compounds by adding SiO2-embedded carbon nanofibers for semiconductor packaging applications

IF 2.8 4区工程技术 Q2 POLYMER SCIENCE

Macromolecular Research Pub Date : 2024-10-23 DOI:10.1007/s13233-024-00317-y

Yeon-Ryong Chu, Zambaga Otgonbayar, Gyu-Sik Park, Suk Jekal, Ha-Yeong Kim, Jiwon Kim, Yoon-Ho Ra, Seulki Song, Chang-Min Yoon

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引用次数: 0

Abstract

This study presents the synthesis of silica-embedded carbon nanofibers (SiO₂/eCNFs) as additives to enhance the heat dissipation properties of epoxy molding compounds (EMCs) for semiconductor packaging. Three different sized SiO₂ nanoparticles were prepared and added to the precursor solution for polyacrylonitrile (PAN) nanofibers. Through electrospinning and carbonization, SiO₂ nanoparticles-embedded PAN nanofibers were successfully converted to SiO₂/eCNFs. As-fabricated SiO₂/eCNFs were mixed with EMC in different concentrations from 0.1 to 1.0 wt% to investigate the effect of SiO₂/eCNFs on EMC in perspective of thermal and mechanical properties. Under our experimental conditions, the addition of 500SiO₂/eCNFs with 0.4 wt% EMC achieved a 67% enhancement in thermal conductivity and a 43% higher impact strength compared to pristine EMC. The improved thermal and mechanical properties by adding SiO₂/eCNFs additives can be attributed to two factors: one-dimensional carbon and embedded SiO₂ nanoparticles. The presence of one-dimensional carbon successfully enhanced the thermal conductivity owing to its natural graphitic characteristics and dimensional advantages. In addition, the optimal size of the SiO₂ nanoparticles provided more heat dissipation routes while maintaining the packing factor compatibility with the SiO₂ fillers in the EMC. In practical EMC applications for semiconductor chips, infrared (IR) camera observations confirmed a faster increase in the surface temperature with the use of SiO₂/eCNFs-EMC, demonstrating the potential of these new EMC additives as next-generation high-performance semiconductors.

Graphical abstract

The improvement in the thermal conductivity of the chip molded in epoxy molding compound (EMC) through the addition of SiO₂-embedded carbon nanofibers (SiO₂/eCNFs) is demonstrated. The SiO₂/eCNFs-EMC molded chips exhibited enhanced thermal conductivity, attributed to the formation of heat pathways through the combination of SiO₂ and CNFs.

查看原文本刊更多论文

通过在半导体封装应用中添加二氧化硅嵌入碳纳米纤维来提高环氧成型化合物的导热性

本文研究了二氧化硅包埋碳纳米纤维（SiO2/eCNFs）作为半导体封装环氧成型化合物（EMCs）的散热性能添加剂的合成。制备了三种不同粒径的SiO2纳米颗粒，并将其加入到聚丙烯腈（PAN）纳米纤维的前驱体溶液中。通过静电纺丝和碳化，成功地将包埋SiO2纳米颗粒的PAN纳米纤维转化为SiO2/ ecfs。将制备好的SiO2/ ecfs以0.1 ~ 1.0 wt%的不同浓度与EMC混合，从热性能和力学性能的角度研究了SiO2/ ecfs对EMC的影响。在我们的实验条件下，与原始EMC相比，添加含有0.4 wt% EMC的500SiO2/eCNFs的导热系数提高了67%，冲击强度提高了43%。通过添加SiO2/eCNFs添加剂可以改善材料的热性能和力学性能，这主要归因于两个因素：一维碳和嵌入SiO2纳米颗粒。一维碳的存在由于其天然的石墨特性和尺寸优势而成功地增强了导热性。此外，SiO2纳米颗粒的最佳尺寸提供了更多的散热途径，同时保持了电磁兼容中SiO2填料的填充因子相容性。在半导体芯片的实际EMC应用中，红外（IR）相机观察证实，使用SiO2/eCNFs-EMC可以更快地提高表面温度，这证明了这些新型EMC添加剂作为下一代高性能半导体的潜力。图摘要：本文证明了在环氧树脂中加入二氧化硅包埋纳米碳纤维（SiO2/eCNFs），可以提高环氧树脂的导热性。SiO2/ ecfs - emc模制芯片的导热性能增强，这是由于SiO2与CNFs的结合形成了热传导通道。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Macromolecular Research 工程技术-高分子科学

CiteScore

4.70

自引率

8.30%

发文量

100

审稿时长

1.3 months

期刊介绍： Original research on all aspects of polymer science, engineering and technology, including nanotechnology Presents original research articles on all aspects of polymer science, engineering and technology Coverage extends to such topics as nanotechnology, biotechnology and information technology The English-language journal of the Polymer Society of Korea Macromolecular Research is a scientific journal published monthly by the Polymer Society of Korea. Macromolecular Research publishes original researches on all aspects of polymer science, engineering, and technology as well as new emerging technologies using polymeric materials including nanotechnology, biotechnology, and information technology in forms of Articles, Communications, Notes, Reviews, and Feature articles.