A Study of the Influence of Process Parameters of AP PECVD on the Mechanical Properties of Silica-like Films Deposited on Polycarbonate

IF 2.8 3区 材料科学 Q3 CHEMISTRY, PHYSICAL
Silicon Pub Date : 2024-10-21 DOI:10.1007/s12633-024-03178-3
Anastasia S. Bil, Sergei E. Alexandrov
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引用次数: 0

Abstract

The ability to resist plastic deformation of the surface is extremely important for polycarbonates (PC), which are widely used in various industrial applications. This work is dedicated to the study of the possibility of using atmospheric pressure (AP) plasma enhanced chemical vapour deposition (PECVD) in dielectric barrier discharge (DBD) for the deposition of silica-like films as a method of strengthening of the PC surfaces. This is the first systematic study of the effect of the main process parameters on microhardness, scratch resistance and abrasion resistance of protective silica-like layers deposited on PC by this method using hexamethyldisiloxane (HMDSO) as a silicon-containing reagent. Also the numerical evaluation of the above mentioned properties of the coatings has been carried out. It has been found that the surface microhardness is most dependent on the amount of oxygen added to the gas mixture, the abrasion resistance is most affected by the electrical power absorbed in the discharge, and the scratch resistance is highly influenced by all process parameters. It has been shown experimentally that the microhardness of such silica-like films can reach 10 GPa (close to the typical value for quartz) and the near-surface microhardness of PC can be increased almost two times, scratch resistance increases by 8 points, and rolling abrasion resistance increases from 56 to 95% when the coating with the thickness of several dozen nm was deposited.

AP PECVD工艺参数对聚碳酸酯类二氧化硅薄膜力学性能影响的研究
对于广泛应用于各种工业应用的聚碳酸酯(PC)来说,抗表面塑性变形的能力是极其重要的。这项工作致力于研究在介质阻挡放电(DBD)中使用常压(AP)等离子体增强化学气相沉积(PECVD)沉积二氧化硅类薄膜作为增强PC表面的方法的可能性。本文首次以六甲基二硅氧烷(HMDSO)为含硅试剂,系统研究了主要工艺参数对该方法沉积在PC上的类硅保护层显微硬度、耐划伤性和耐磨性的影响。并对涂层的上述性能进行了数值评价。研究发现,表面显微硬度最依赖于混合气体中加入氧气的量,耐磨性受放电中吸收的电功率影响最大,抗划伤性受所有工艺参数的影响很大。实验表明,当制备厚度为几十nm的类二氧化硅薄膜时,其显微硬度可达10 GPa(接近石英的典型值),PC近表面显微硬度可提高近2倍,抗划伤性提高8点,滚动耐磨性从56提高到95%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Silicon
Silicon CHEMISTRY, PHYSICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
5.90
自引率
20.60%
发文量
685
审稿时长
>12 weeks
期刊介绍: The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.
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