Electromagnetic Inductive Coupling Analysis (EMICA): A New Tool for Imaging Internal Defects in Carbon Fiber Composites

IF 2.6 3区 材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Kevin Finch, David C. Long, Taylor Ott, Bradley Spatafore, Joshua R. Biller
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引用次数: 0

Abstract

Carbon fiber laminates enjoy a wide range of applications from innovative architectural design to aerospace and the safety overwrap for pressure vessels. In the case of carbon fiber overwrapped pressure vessels (COPVs), the overwrap thickness can vary from 6 mm (∼ 0.25 inch) for thin-walled COPV up to 25 mm (∼ 1”) or more for thick walled COPV, depending on the vessel type. The failure mechanisms for carbon fiber are more complex than for metals and monitoring COPVs for defects or fatigue over their lifetime is further complicated by the thickness of the carbon fiber used. Traditional electromagnetic NDE methods, such as eddy current testing (ECT) for imaging defects in these structures has been severely limited, achieving accurate identification to about 4 mm in depth. In this paper, a new technique is introduced to address these shortcomings, Electro-Magnetic-Inductive-Coupling-Analysis, or EMICA, can be used to detect damage inside thick carbon fiber laminate pieces. EMICA is based on the interaction of the repeating three-dimensional structure of carbon fiber and low-frequency electromagnetic waves that are allowed to actively spread through the conductive bulk composite material highlighting defects such as delamination and fiber disruptions, well below the laminate surface. In this paper, EMICA is demonstrated in flat carbon fiber laminates up to ∼ 12 mm (0.5”) thick, made in-house, with known defects hidden through the thickness of the piece that cannot be detected via visual inspection. Delaminations, cuts/cracks, and the underlying ply layup structure can all be identified in the EMICA images. It is shown that three imbedded PTFE delaminations at varying depths (3 mm, 6 mm, 9 mm) are simultaneously imaged using EMICA in a ½” thick CF laminate [0°/90°] panel with an excitation frequency of 40 kHz. Furthermore, the electromagnetic focal point can be chosen within the depth of CF composites by intelligently selecting the excitation frequency for the ply layup being probed, while the traditional penetration depth equation does not hold true in these complex structures.

Abstract Image

电磁电感耦合分析(EMICA):碳纤维复合材料内部缺陷成像的新工具
碳纤维层压板具有广泛的应用,从创新的建筑设计到航空航天和压力容器的安全外包装。在碳纤维包覆压力容器(COPV)的情况下,根据容器类型,包覆厚度可以从薄壁COPV的6毫米(~ 0.25英寸)到厚壁COPV的25毫米(~ 1英寸)或更多。与金属相比,碳纤维的失效机制更为复杂,在使用寿命期间监测copv的缺陷或疲劳情况因碳纤维的厚度而变得更加复杂。传统的电磁无损检测方法,如涡流检测(ECT),在这些结构中成像缺陷的能力受到严重限制,只能准确识别深度约为4毫米。本文介绍了一种新的技术来解决这些缺点,即电磁感应耦合分析,或EMICA,可以用来检测厚碳纤维层压片内部的损伤。EMICA是基于碳纤维的重复三维结构和低频电磁波的相互作用,低频电磁波被允许主动传播通过导电体复合材料,突出缺陷,如分层和纤维中断,远低于层压表面。在本文中,EMICA在高达12毫米(0.5英寸)厚的平面碳纤维层压板中进行了演示,该层压板是内部制造的,通过片的厚度隐藏了无法通过目测检测到的已知缺陷。分层、切口/裂缝和底层层状层状结构都可以在EMICA图像中识别。结果表明,在激励频率为40 kHz的1 / 2英寸厚CF层压[0°/90°]面板上,使用EMICA可以同时对不同深度(3 mm, 6 mm, 9 mm)的三个嵌入PTFE分层进行成像。此外,通过智能选择被探测层的激励频率,可以在CF复合材料的深度范围内选择电磁焦点,而传统的穿透深度方程在这些复杂结构中并不适用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Nondestructive Evaluation
Journal of Nondestructive Evaluation 工程技术-材料科学:表征与测试
CiteScore
4.90
自引率
7.10%
发文量
67
审稿时长
9 months
期刊介绍: Journal of Nondestructive Evaluation provides a forum for the broad range of scientific and engineering activities involved in developing a quantitative nondestructive evaluation (NDE) capability. This interdisciplinary journal publishes papers on the development of new equipment, analyses, and approaches to nondestructive measurements.
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