Humidity sensing studies on ZnO/bismuth borate glass heterostructure thin films

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Upesh Kumar Appikonda, Paramesh Gadige
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Abstract

Semiconducting bismuth borate glasses in xBi2O3–(1 − x)B2O3 system where x = 0.25, 0.50, and 0.75 (in mol.), and ZnO-glass heterostructures are studied for humidity sensing. Glass samples are prepared using melt-quenching method, whereas pristine ZnO is synthesized by sol–gel process. Heterostructure samples are obtained by adding different weight fractions of pulverized bismuth borate glass to the ZnO sol. Conducting silver paint and graphite pencil are used to make electrodes on silicon wafer and flexible paper substrates, respectively. ZnO, glass, and ZnO-glass heterostructure thin films are deposited on both the substrates through drop-casting method. Structural and microstructural changes of heterostructure films are studied using X-ray powder diffraction (XRD), and scanning electron microscope (SEM). Pristine ZnO, glass and ZnO-glass heterostructure thin film samples are tested for humidity sensing at room temperature by monitoring changes in the resistance of the samples. ZnO-glass heterostructures have shown enhanced humidity sensitivity with the lowest response and recovery times (12 and 16 s, respectively), which indicates their promising nature for humidity sensing applications. Enhanced sensing properties are attributed to the unique microstructural features of ZnO nanoparticles which are grown on glass particles through a heterogeneous nucleation process and semiconducting ZnO/glass heterostructure mechanism.

ZnO/硼酸铋玻璃异质结构薄膜的湿度传感研究
研究了xBi2O3 -(1−x)B2O3体系中x = 0.25, 0.50和0.75 (mol.)的半导体硼酸铋玻璃和zno -玻璃异质结构的湿度传感。玻璃样品采用熔淬法制备,而原始ZnO采用溶胶-凝胶法制备。在ZnO溶胶中加入不同重量分数的硼酸铋玻璃粉,得到异质结构样品。导电银漆和石墨铅笔分别在硅片和柔性纸衬底上制作电极。通过滴铸法制备ZnO、玻璃和ZnO-玻璃异质结构薄膜。利用x射线粉末衍射(XRD)和扫描电子显微镜(SEM)研究了异质结构薄膜的结构和微观结构变化。通过监测样品的电阻变化,在室温下测试了原始ZnO、玻璃和ZnO-玻璃异质结构薄膜样品的湿度传感。zno -玻璃异质结构具有较强的湿度敏感性,其响应时间和恢复时间最短(分别为12 s和16 s),这表明其在湿度传感领域具有广阔的应用前景。ZnO纳米粒子通过非均相成核过程和半导体ZnO/玻璃异质结构机制生长在玻璃颗粒上,其独特的微观结构特征增强了传感性能。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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