Jiawei Luo, Ze Lv, Linping Zhang, Yi Zhong, Hong Xu, Zhiping Mao
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引用次数: 0
Abstract
Multifunctional materials that muster electromagnetic waves absorption (EMA) and thermal conduction features are highly desirable in electronic packaging of advanced electronics. However, traditional carbon-based and ceramic-based materials often rely on semiempirical rules when preparing these bifunctional composites because incompatibility between dielectric behavior and thermal conductivity. Herein, two bifunctional materials (SiC@RGO/EP (SCGE) and Si3N4@RGO/EP (SNGE)) with different dielectric features are obtained by assembling 1D ceramics whiskers and 2D graphene sheets to construct 3D porous skeleton followed by epoxy (EP) encapsulation to understand this underlying relationship. Since semiconductor-type silicon carbide (SiC) ceramics enhance the conductivity and dielectric response of material, thereby significantly intensifying electromagnetic waves loss, the obtained SCGE material harvests remarkable minimal reflection loss values (RLmin) of −85.92 dB at 2.07 mm, which outperform reported SiC-based EMA materials so far. Whereas SNGE material prepared by introducing insulator silicon nitride (Si3N4) ceramics only delivers thermal conductivity (0.86 W m−1 K−1) close to that of SCGE (0.93 W m−1 K−1), but EMA performance is dramatically reduced with RLmin of −19.88 dB at 5 mm. The finding of this work offers new insights for modulating dielectric behavior of ceramic materials and carbon-based materials to achieve the integration of EMA and thermal conduction functions.
具有电磁波吸收(EMA)和热传导特性的多功能材料在先进电子器件的电子封装中非常受欢迎。然而,传统的碳基和陶瓷基材料在制备这些双功能复合材料时往往依赖于半经验法则,因为介电行为和热导率之间不相容。本文通过将一维陶瓷晶须和二维石墨烯薄片组装成三维多孔骨架,然后用环氧树脂(EP)封装,得到了两种具有不同介电特性的双功能材料(SiC@RGO/EP(SCGE)和Si3N4@RGO/EP(SNGE)),以了解这种内在关系。由于半导体型碳化硅(SiC)陶瓷增强了材料的导电性和介电响应,从而大大加剧了电磁波损耗,因此所获得的 SCGE 材料在 2.07 mm 时的最小反射损耗值(RLmin)达到了显著的 -85.92 dB,优于目前已报道的基于 SiC 的 EMA 材料。而通过引入绝缘体氮化硅(Si3N4)陶瓷制备的 SNGE 材料的热导率(0.86 W m-1 K-1)与 SCGE(0.93 W m-1 K-1)接近,但 EMA 性能却大幅降低,5 毫米处的 RLmin 为 -19.88 dB。这项研究成果为调控陶瓷材料和碳基材料的介电行为以实现 EMA 和热传导功能的整合提供了新的思路。
期刊介绍:
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