Microwave Capacitive Pressure Sensor Based on an Additively Manufactured Elastic Layer

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Amirhossein Karami-Horestani;Sandra Rodini;Simone Genovesi;Ferran Paredes;Filippo Costa;Ferran Martín
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引用次数: 0

Abstract

This article presents a capacitive sensor useful for measuring pressure in the range 0–2460 Pa. The transduction mechanism is capacitance variation caused by changes in the force exerted on the sensing element. Such sensing element is a one-port coplanar waveguide (CPW) terminated with a conductive patch wider than the CPW central strip and a step-impedance resonator (SIR), etched in an independent substrate and capacitively coupled to the patch. By sandwiching an additively manufactured malleable (elastic) material between the CPW and the SIR substrate, pressure changes modify the capacitance of the SIR due to the variation of: 1) the dielectric constant of such material and 2) the separation between the SIR and CPW metal layers. The output variable is the phase of the reflection coefficient at the operating frequency, set to a value (within the microwave range) where the phase response exhibits a high phase slope (since this boosts the sensitivity). Thus, the device is a single-frequency sensor that simply necessitates a microwave oscillator, or a voltage-controlled oscillator (VCO), for signal generation in an operative environment. The maximum achieved sensitivity is 650°/kPa.
基于增材制造弹性层的微波电容式压力传感器
本文介绍了一种用于测量0 - 2460pa范围内压力的电容式传感器。这种传导机制是由施加在传感元件上的力的变化引起的电容变化。这种传感元件是一个单端口共面波导(CPW),端接一个比CPW中心带宽的导电贴片和一个阶进阻抗谐振器(SIR),蚀刻在一个独立的衬底上,并与贴片电容耦合。通过在CPW和SIR衬底之间夹入一种增材制造的可锻铸(弹性)材料,压力变化会改变SIR的电容,这是由于:1)这种材料的介电常数和2)SIR和CPW金属层之间的分离。输出变量是工作频率下反射系数的相位,设置为一个值(在微波范围内),其中相位响应显示出高相位斜率(因为这提高了灵敏度)。因此,该设备是一个单频传感器,只需要一个微波振荡器或电压控制振荡器(VCO),用于在操作环境中产生信号。最大灵敏度为650°/kPa。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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