Three-Dimensional Stacked Stretchable Thermoelectric Device for Virtual Sensation

IF 8.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zhenlong Huang, Longpeng Yang, Tao Chen, Rui Zhou, Yan Jiang, Binbin Jiang, Dongfeng Xue, Yuan Lin
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引用次数: 0

Abstract

Stretchable electronics have significant applications in wearable applications. However, the extremely low thermal conductivity of elastic encapsulation hinders heat dissipation, leading to performance degradation. For instance, stretchable thermoelectric devices (TEDs) can be used for skin temperature regulation, but poor thermal management limits their cooling performance. This article proposes advanced material and fabrication optimization for stretchable TED with a three-dimensional structure, achieving enhanced performance through the stacked integration of multilayer thermoelectric unit networks. Techniques such as laser ablation are employed to create thermal vias, significantly improving interlayer thermal exchange efficiency. The resulting device can achieve 30% stretching and provides a stable and long-term 10 °C skin cooling under normal arm movement. Additionally, by integrating temperature sensing and control circuits, the fabricated wearable closed-loop system can programmatically regulate skin temperature, suitable for virtual temperature and pain sensation. The 3D integration method and thermal via construction technique proposed in this article can also be applied to other high-power stretchable electronics.

Abstract Image

用于虚拟感觉的三维堆叠可拉伸热电装置
可拉伸电子产品在可穿戴应用中具有重要的应用。然而,弹性封装的极低导热系数阻碍了散热,导致性能下降。例如,可拉伸热电装置(ted)可用于皮肤温度调节,但不良的热管理限制了它们的冷却性能。本文提出了具有三维结构的可拉伸TED的先进材料和制造优化,通过多层热电单元网络的堆叠集成实现了性能的增强。采用激光烧蚀等技术制造热通孔,显著提高了层间热交换效率。由此产生的装置可以实现30%的拉伸,并在正常手臂运动下提供稳定和长期的10°C皮肤冷却。此外,通过集成温度传感和控制电路,制造的可穿戴闭环系统可以编程调节皮肤温度,适用于虚拟温度和疼痛感觉。本文提出的三维集成方法和热导孔构造技术也可应用于其他大功率可拉伸电子器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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