Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints

IF 3.5 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Journal of Materials Science Pub Date : 2024-12-21 DOI:10.1007/s10853-024-10549-z

Jin Zhao, Xiao-liang Ji, Jin-jiang He, Zhi-chao Hou, Yao Song, Hong-lei Zhu, Bing-rui Liu, Qiang Jia, Yi-shu Wang

{"title":"Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints","authors":"Jin Zhao, Xiao-liang Ji, Jin-jiang He, Zhi-chao Hou, Yao Song, Hong-lei Zhu, Bing-rui Liu, Qiang Jia, Yi-shu Wang","doi":"10.1007/s10853-024-10549-z","DOIUrl":null,"url":null,"abstract":"<div><p>The demand for high-computing-power AI chips in the consumer electronics market is driving the development of electronic packaging technology toward high-reliability packaging. The application of low melting point solder Sn58Bi in high-reliability 3D packages is currently facing issues of low toughness and poor in-service reliability. A new strategy differentiating the alloying of conventional solders has been proposed, which produced solder joints with improved microstructure and properties through electric pulse auxiliary reflow soldering of Sn58Bi/Cu solder joints. The electric pulse resulted in Bi-rich phases and different morphologies of pre-eutectic Sn in the solder joints via the incubation effect, improving the shear strength of the solder joints. This research provides a new strategy for improving the strength and reliability of Sn58Bi solder joints in advanced electronic interconnection.</p></div>","PeriodicalId":645,"journal":{"name":"Journal of Materials Science","volume":"60 2","pages":"922 - 938"},"PeriodicalIF":3.5000,"publicationDate":"2024-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10853-024-10549-z","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

The demand for high-computing-power AI chips in the consumer electronics market is driving the development of electronic packaging technology toward high-reliability packaging. The application of low melting point solder Sn58Bi in high-reliability 3D packages is currently facing issues of low toughness and poor in-service reliability. A new strategy differentiating the alloying of conventional solders has been proposed, which produced solder joints with improved microstructure and properties through electric pulse auxiliary reflow soldering of Sn58Bi/Cu solder joints. The electric pulse resulted in Bi-rich phases and different morphologies of pre-eutectic Sn in the solder joints via the incubation effect, improving the shear strength of the solder joints. This research provides a new strategy for improving the strength and reliability of Sn58Bi solder joints in advanced electronic interconnection.

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电脉冲辅助回流焊对Sn58Bi/Cu焊点组织和性能的影响

消费电子市场对高计算能力的AI芯片的需求正在推动电子封装技术向高可靠性封装的方向发展。低熔点焊料Sn58Bi在高可靠性3D封装中的应用，目前面临韧性低、使用可靠性差的问题。提出了一种区别传统焊料合金化的新策略，利用电脉冲辅助回流焊对Sn58Bi/Cu焊点进行微结构和性能改善。电脉冲通过培养效应在焊点中形成富bi相和不同形态的预共晶锡，提高了焊点的抗剪强度。该研究为提高先进电子互连中Sn58Bi焊点的强度和可靠性提供了一种新的策略。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science 工程技术-材料科学：综合

CiteScore

7.90

自引率

4.40%

发文量

1297

审稿时长

2.4 months

期刊介绍： The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.