A Wideband Millimeter-Wave Circularly Polarized Dielectric Resonator Antenna With a Stacked Strip Using SISL Technology for 5G Applications

IF 3.7 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2024-11-12 DOI:10.1109/LAWP.2024.3496476

Ningning Yan;Hongyan Yuan;Yu Luo;Kaixue Ma

引用次数: 0

Abstract

A wideband millimeter-wave circularly polarized (CP) dielectric resonator antenna (DRA) is proposed in this letter based on substrate-integrated suspended line (SISL). To generate CP waves, a square DRA is cut off two corners. The introduction of the dielectric ring not only serves to fix the DR, but also improves the antenna matching and axial ratio bandwidth. In order to increase the axial ratio bandwidth and realized gain, a stacked strip is introduced on the C1 layer. The proposed antenna is fabricated and measured, and the measured results show the antenna has an impedance bandwidth of 27.94%, which is from 23.4 GHz to 31 GHz. The axial ratio bandwidth of 30.55% is from 23.3 GHz to 31.7 GHz, and the measured peak gain is 7.5 dBic.

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基于SISL技术的5G叠层宽带毫米波圆极化介质谐振器天线

本文提出了一种基于基片集成悬浮线（SISL）的宽带毫米波圆极化介质谐振器天线（DRA）。为了产生CP波，一个正方形的DRA被切断了两个角。引入介电环不仅可以固定DR，还可以提高天线匹配和轴比带宽。为了提高轴比带宽和实现增益，在C1层上引入了堆叠带。对该天线进行了制作和测试，测试结果表明，该天线的阻抗带宽为27.94%，范围为23.4 GHz ~ 31 GHz。轴比带宽为30.55%，在23.3 GHz ~ 31.7 GHz范围内，测得峰值增益为7.5 dBic。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.