Design and characterization of novel graphene-enhanced vapor chambers for lightweight and high-performance electronics cooling.

IF 2.9 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Nanotechnology Pub Date : 2025-01-06 DOI:10.1088/1361-6528/ad9f6d

Markus Enmark, Murali Murugesan, Hongfeng Zhang, Torbjörn M J Nilsson, Kai J Kallio, Arian Kamal, Johan Liu

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Abstract

The trend towards miniaturization of electronics and increasing transistor density in semiconductors requires more efficient cooling solutions. Vapor chambers are well established passive cooling devices that are used in a wide variety of electronics. Commercial vapor chambers are often made of high-density metals such as copper which can be a downside in lightweight applications such as laptops, smartphones, and tablets. In this study, different novel lightweight graphene-enhanced vapor chambers were built using graphene-assembled film with high thermal conductivity as envelope material. The thermal performance of the designed graphene-enhanced vapor chambers was characterized in a customized test rig and compared to a copper vapor chamber. One of the graphene-enhanced vapor chambers was shown to have 21.6% lower thermal resistance than that of a copper vapor chamber with the same design. A mass-based thermal resistance parameter was introduced as a figure of merit to account for the superior low density of the graphene-enhanced vapor chambers. The mass-based thermal resistance of the graphene-enhanced vapor chamber was seen to be 46.5% lower than that of the copper vapor chamber. The result of this study shows that replacing copper with graphene-assembled film as envelope in vapor chambers can both reduce thermal resistance and decrease the mass of the device. Hence, it is believed that graphene-enhanced vapor chambers have great potential for replacing conventional metal-based vapor chambers in lightweight and high-performance electronics and power module cooling applications in the future.

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用于轻量化和高性能电子冷却的新型石墨烯增强蒸汽室的设计和表征。

电子产品小型化的趋势和半导体中晶体管密度的增加需要更有效的冷却解决方案。蒸汽室是一种成熟的被动冷却装置，广泛应用于各种电子产品中。商业蒸汽室通常由高密度金属（如铜）制成，这在笔记本电脑、智能手机和平板电脑等轻型应用中可能是一个缺点。在本研究中，使用具有高导热性的石墨烯组装膜作为包壳材料，构建了不同的新型轻质石墨烯增强蒸汽室。设计的石墨烯增强蒸汽室的热性能在一个定制的测试平台上进行了表征，并与铜蒸汽室进行了比较。其中一种石墨烯增强蒸汽室的热阻比相同设计的铜蒸汽室低21.6%。引入了一个基于质量的热阻参数，作为考虑石墨烯增强蒸汽室优越的低密度的优点。石墨烯增强蒸汽室的质量热阻比铜蒸汽室低46.5%。研究结果表明，用石墨烯组装薄膜代替铜作为蒸汽室的包壳，既可以降低热阻，又可以降低器件的质量。因此，人们相信石墨烯增强的蒸汽室在未来的轻量化和高性能电子和电源模块冷却应用中具有取代传统金属基蒸汽室的巨大潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Nanotechnology 工程技术-材料科学：综合

CiteScore

7.10

自引率

5.70%

发文量

820

审稿时长

2.5 months

期刊介绍： The journal aims to publish papers at the forefront of nanoscale science and technology and especially those of an interdisciplinary nature. Here, nanotechnology is taken to include the ability to individually address, control, and modify structures, materials and devices with nanometre precision, and the synthesis of such structures into systems of micro- and macroscopic dimensions such as MEMS based devices. It encompasses the understanding of the fundamental physics, chemistry, biology and technology of nanometre-scale objects and how such objects can be used in the areas of computation, sensors, nanostructured materials and nano-biotechnology.