Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

IF 2.1 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Electronic Materials Letters Pub Date : 2024-11-30 DOI:10.1007/s13391-024-00535-7

Yifan Yao, Zhunan Lu, Yuxuan An, K. N. Tu, Yingxia Liu

引用次数: 0

Abstract

Electromigration (EM) failure in solder joints is a persistent reliability concern, especially in advanced electronic packaging structures. In this study, we conducted an EM experiment on solder joints with asymmetric under-bump-metallization (UBM) thicknesses. Open failure occurred at the solder joint with no current crowding effect but the highest atomic flux of EM, which is related to Sn grain orientation. Our work tries to reveal a counteracting effect of Sn grain orientation on current crowding and the essential reason for the EM failure mechanism of solder joints.

Graphical Abstract

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锡晶粒取向对焊点电迁移失效中电流拥挤的抵消作用

焊点的电迁移（EM）失效是一个长期存在的可靠性问题，特别是在先进的电子封装结构中。在这项研究中，我们对不对称凸凸下金属化（UBM）厚度的焊点进行了电磁实验。在无电流拥挤效应的情况下，焊点出现了开口破坏，但电磁原子通量最高，这与锡的晶粒取向有关。我们的工作试图揭示锡的晶粒取向对电流拥挤的抵消作用和焊点电磁破坏机制的根本原因。图形抽象

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Electronic Materials Letters 工程技术-材料科学：综合

CiteScore

4.70

自引率

20.80%

发文量

审稿时长

2.3 months

期刊介绍： Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.