Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

IF 2.1 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Electronic Materials Letters Pub Date : 2024-11-30 DOI:10.1007/s13391-024-00535-7

Yifan Yao, Zhunan Lu, Yuxuan An, K. N. Tu, Yingxia Liu

引用次数: 0

Abstract

Electromigration (EM) failure in solder joints is a persistent reliability concern, especially in advanced electronic packaging structures. In this study, we conducted an EM experiment on solder joints with asymmetric under-bump-metallization (UBM) thicknesses. Open failure occurred at the solder joint with no current crowding effect but the highest atomic flux of EM, which is related to Sn grain orientation. Our work tries to reveal a counteracting effect of Sn grain orientation on current crowding and the essential reason for the EM failure mechanism of solder joints.

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来源期刊

Electronic Materials Letters 工程技术-材料科学：综合

CiteScore

4.70

自引率

20.80%

发文量

审稿时长

2.3 months

期刊介绍： Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.