Research on vibration reliability of solder joint based on modal experiment of PCBA

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-24 DOI:10.1007/s10854-024-14127-6

Fang Liu, Runze Gong, Zhongwei Duan, Zhen Wang, Jincheng Zhou

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引用次数: 0

Abstract

This paper investigates the dynamic behavior of printed circuit board assembly (PCBA) and the reliability of board-level solder joints under thermal–vibration combined load through modal experiments and finite element (FE) analysis. Firstly, a combination of free modal test and FE simulation was adopted to obtain the equivalent material parameters of bare printed circuit board (PCB), which were utilized in the FE modeling of PCBA, and the effectiveness of the FE model was verified by experimental modal analysis. Modal tests and simulations were performed at different temperatures (22 ℃, 60 ℃) to investigate the effect of temperature on the dynamic behavior of the PCBA. Then, narrow-band random vibration simulations with constant acceleration power spectral density (PSD) amplitude were conducted on the PCBA at different temperatures. Finally, the Steinberg model was adopted to predict the vibration lifetime of the weakest solder joint. The results indicate that modal analysis is an effective method for establishing FE models of PCBA, and the temperature change significantly affects the dynamic characteristics and vibration reliability of PCBA. As the temperature changes from 22 ℃ to 60 ℃, the natural frequencies of PCBA decrease. The stiffness of the PCBA decreases as the temperature rises, leading to increased vibration deformation of the PCBA and larger stress and strain in the solder joints and PCB. Furthermore, under vibration load, the fatigue life of the solder joints is reduced by 32% due to the increasing temperature.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.