Research on vibration reliability of solder joint based on modal experiment of PCBA

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-24 DOI:10.1007/s10854-024-14127-6

Fang Liu, Runze Gong, Zhongwei Duan, Zhen Wang, Jincheng Zhou

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引用次数: 0

Abstract

This paper investigates the dynamic behavior of printed circuit board assembly (PCBA) and the reliability of board-level solder joints under thermal–vibration combined load through modal experiments and finite element (FE) analysis. Firstly, a combination of free modal test and FE simulation was adopted to obtain the equivalent material parameters of bare printed circuit board (PCB), which were utilized in the FE modeling of PCBA, and the effectiveness of the FE model was verified by experimental modal analysis. Modal tests and simulations were performed at different temperatures (22 ℃, 60 ℃) to investigate the effect of temperature on the dynamic behavior of the PCBA. Then, narrow-band random vibration simulations with constant acceleration power spectral density (PSD) amplitude were conducted on the PCBA at different temperatures. Finally, the Steinberg model was adopted to predict the vibration lifetime of the weakest solder joint. The results indicate that modal analysis is an effective method for establishing FE models of PCBA, and the temperature change significantly affects the dynamic characteristics and vibration reliability of PCBA. As the temperature changes from 22 ℃ to 60 ℃, the natural frequencies of PCBA decrease. The stiffness of the PCBA decreases as the temperature rises, leading to increased vibration deformation of the PCBA and larger stress and strain in the solder joints and PCB. Furthermore, under vibration load, the fatigue life of the solder joints is reduced by 32% due to the increasing temperature.

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基于PCBA模态试验的焊点振动可靠性研究

通过模态试验和有限元分析，研究了印制电路板组件（PCBA）在热-振动复合载荷作用下的动态行为和板级焊点的可靠性。首先，采用自由模态试验与有限元模拟相结合的方法，获得了裸印刷电路板（PCB）的等效材料参数，并将这些参数用于PCBA的有限元建模，通过实验模态分析验证了有限元模型的有效性。在不同温度（22℃、60℃）下进行模态试验和模拟，研究温度对PCBA动态行为的影响。然后，在不同温度下对PCBA进行了等加速度功率谱密度（PSD）幅值的窄带随机振动模拟。最后，采用Steinberg模型对最弱焊点的振动寿命进行了预测。结果表明，模态分析是建立PCBA有限元模型的有效方法，温度变化对PCBA的动态特性和振动可靠性有显著影响。在22 ~ 60℃温度范围内，PCBA的固有频率降低。随着温度的升高，PCBA的刚度降低，导致PCBA的振动变形增大，焊点和PCB中的应力和应变增大。此外，在振动载荷下，由于温度升高，焊点的疲劳寿命降低了32%。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.