Short-fiber piezocomposite and its bandwidth enhancement for high-frequency medical ultrasound transducer

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhaoping Yang, Xiaobing Li, Fenglong Sun, Qiyuan Zhang, Jun Chen, Hongling Zhu, Shengdong Nie, Na Yang, Changjiang Zhou, Wenning Di
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引用次数: 0

Abstract

High performance 1–3 piezocomposite is crucial to high-frequency medical ultrasound imaging as its performance enhancement to an ultrasound transducer. A bandwidth enhancement effect had been found when a novel PZT-based short-fiber piezocomposite was fabricated and applied in the transducer. The electromechanical coupling coefficient kt of the short-fiber piezocomposite was as high as 63% at high frequency. An ultra-high bandwidth of the ultrasound transducer obtained to be 131.6% @-6 dB. The high performances of the piezocomposite were owing to the longitudinal vibration enhancement and lateral vibrations depression which were derived from the shape and randomized distribution of the ceramic pillars, respectively. It indicates that the PZT short-fiber piezocomposite is a promising candidate for commercial high-frequency medical ultrasound transducers.

Abstract Image

短纤维压电复合材料及其高频医用超声换能器的带宽增强
高性能1-3压电复合材料是高频医学超声成像的关键,因为它可以增强超声换能器的性能。制备了一种新型压电陶瓷基短纤维压电复合材料,并将其应用于换能器中,获得了带宽增强效果。在高频下,短纤维压电复合材料的机电耦合系数kt高达63%。超声换能器的超高带宽为131.6% @-6 dB。陶瓷柱的形状和随机分布分别增强了纵向振动和抑制了横向振动,从而提高了复合材料的性能。这表明PZT短纤维压电复合材料是一种很有前途的商用高频医用超声换能器。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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