Wafer-scale single-crystal two-dimensional materials for integrated optoelectronics

InfoScience Pub Date : 2024-08-27 DOI:10.1002/inc2.12015
Xin Feng, Yiran Ma, Tian Huang, Shenghong Liu, Lixin Liu, Erjuan Guo, Kailang Liu, Yuan Li, Xing Zhou, Huiqiao Li, Tianyou Zhai
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Abstract

Since the pioneering research on graphene, two-dimensional (2D) materials have been considered as the most promising candidates to continue advancing Moore's Law, and an emerging material family, which has bred a lot of novel functional applications beyond the Si-based integrated circuit. Unfortunately, abundant challenges in the synthesis of wafer-scale single-crystal (WSSC) 2D materials and their on-chip integration technology severely hinder their commercialization road. Over the past few years, significant technique breakthroughs of WSSC 2D materials have been increasingly achieved, accordingly a comprehensive review and critical evaluation of these new advances are pressingly required. In this review article, the outstanding research progress on the synthesis of WSSC 2D materials and 2D material-based on-chip integration technology, including 2D materials integration, nanopatterning, electrode integration, and dielectric integration, are summarized in detail. Then, the major application prospect of different types of WSSC 2D materials in optoelectronics is discussed. Finally, a critical assessment of these advancements is given, as well as the potential challenges and opportunities in the foreseeable future.

Abstract Image

用于集成光电子学的晶圆级单晶二维材料
自石墨烯的开创性研究以来,二维(2D)材料被认为是最有希望继续推进摩尔定律的候选者,也是一个新兴的材料家族,它孕育了许多超越硅基集成电路的新颖功能应用。然而,晶圆级二维单晶材料的合成及其片上集成技术面临的诸多挑战严重阻碍了其商业化道路。在过去的几年里,WSSC二维材料的重大技术突破越来越多,因此迫切需要对这些新进展进行全面的审查和批判性的评估。本文综述了WSSC二维材料的合成以及基于二维材料的片上集成技术(包括二维材料集成、纳米图像化、电极集成和介电集成)的突出研究进展。然后,讨论了不同类型WSSC二维材料在光电子学中的主要应用前景。最后,对这些进步以及可预见的未来的潜在挑战和机遇进行了批判性评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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