Effects of ceramic matrix composition on microwave absorbing performance and mechanical properties in SiCf/mullite composites

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-20 DOI:10.1007/s10854-024-14068-0

Haijun Pan, Fa Luo, Linhan Jing, Chun-Hai Wang, Zhaowen Ren

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引用次数: 0

Abstract

Ceramic matrix composition is crucial for enhancing flexural strength, fracture toughness, and microwave absorbing properties. This work prepared the SiC_f/mullite composites with different Al₂O₃ contents via a precursor infiltration-pyrolysis process (PIP). The phase composition and structure were investigated according to the XRD patterns and Fourier Transform Infrared (FT-IR) of composites. In addition, the effects of Al₂O₃ contents on flexural strength, toughness, and microwave absorbing performance were also investigated. With the increase of the Al₂O₃ contents from 50 wt% (50AC) to 72 wt% (72AC), the flexural strength improved from 210.77 ± 8.15 to 331.02 ± 2.12 MPa, and the fracture modulus from 63.61 ± 3.57 (GPa) to 77.70 ± 1.06 (GPa). In addition, the effective absorption bandwidth (EAB, RL ≤ −10 dB) of 50AC at the thickness of 3.0 mm was 3.89 GHz which covered 93% of the X-band, showing excellent microwave absorption performance.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.